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公开(公告)号：US20230418344A1
公开(公告)日：2023-12-28
申请号：US17846402
申请日：2022-06-22
申请人： Dell Products L.P.
发明人： Bilal Ahmed , Hasnain Shabbir , Richard Eiland
摘要： An information handling system may calculate multiple temperature changes within the information handling system. Each of the temperature changes is across a different bank of components of the information handling system. The system may calculate multiple inlet temperatures, each of which is associated with a different component of the information handling system. The inlet temperatures are utilized in determining whether cooling requirements for the system configuration are met. Based on the temperature changes and the inlet velocities, the system may determine whether the cooling requirements are met. In response to the cooling requirements for the system configuration not being met, the system may decrease a current cooling fan speed for the information handling system. In response to the cooling requirements for the system configuration being met, the system may store the current cooling fan speed.
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公开(公告)号：US11520389B2
公开(公告)日：2022-12-06
申请号：US17146394
申请日：2021-01-11
申请人： DELL PRODUCTS L.P.
发明人： Hasnain Shabbir , Hui Chen
摘要： Disclosed herein are systems and methods of determining a maximum allowable air temperature limit for closed loop (CL) control of the inlet boundary or threshold temperature of a given computer expansion slot that contains a particular mating expansion card. The maximum allowable air temperature limit may be determined for closed loop control of the expansion slot inlet boundary temperature by using reverse correlation of an open loop (OL) cooling tier curve that has been designated for open loop control of cooling air velocity provided to the particular expansion card of the given expansion slot. The reverse correlation may be performed in further view of the particular expansion slot airflow characteristics (e.g., maximum expansion slot airflow velocity capacity or limit) corresponding to a expansion card received in a given expansion slot.
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公开(公告)号：US20220221916A1
公开(公告)日：2022-07-14
申请号：US17146428
申请日：2021-01-11
申请人： DELL PRODUCTS L.P.
发明人： Richard Eiland , Hasnain Shabbir
IPC分类号： G06F1/20
摘要： Disclosed herein are systems and methods that may be implemented in real time to determine the total volumetric rate of airflow through a chassis enclosure of an information handling system platform directly from real time measured cooling fan power consumption in combination with standalone or system-level cooling fan power characteristics (e.g., expressed as cooling fan power curves) that relate cooling fan volumetric airflow rate to cooling fan power consumption at the current fan rotation speed. This determined value of total real time volumetric airflow rate may then be used, for example, by individual system level thermal control algorithms and/or data center level thermal control algorithms.
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公开(公告)号：US10827651B2
公开(公告)日：2020-11-03
申请号：US16046427
申请日：2018-07-26
申请人： Dell Products L.P.
IPC分类号： H05K7/20
摘要： An airflow characterization system includes a first airflow sensor subsystem positioned at a first location on an airflow characterization board base and a second airflow sensor subsystem positioned at a second location on the airflow characterization board base that is different than the first location. An airflow characterization controller is coupled to the first airflow sensor subsystem and the second airflow sensor subsystem. When the airflow characterization board is positioned in a circuit board slot, the airflow characterization controller receives a first airflow signal from the first airflow sensor subsystem during a first time period and receives a second airflow signal from the second airflow sensor subsystem during the first time period. The airflow characterization controller determines a circuit board slot airflow characterization for the circuit board slot based on the first airflow signal and the second airflow signal.
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公开(公告)号：US10779435B2
公开(公告)日：2020-09-15
申请号：US16243442
申请日：2019-01-09
申请人： Dell Products L.P.
摘要： An information handling system includes a rear node that includes an airflow control device a thermal manager. The thermal manager identifies a front node mating event between the rear node and a front node; in response to the front node mating event: obtains front node airflow characteristics for the front node; determines an airflow rate using, at least in part, the front node airflow characteristics; and sets an operating point of the airflow control device based on the airflow rate.
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公开(公告)号：US20200043529A1
公开(公告)日：2020-02-06
申请号：US16054971
申请日：2018-08-03
申请人： Dell Products L.P.
IPC分类号： G11C5/04 , G06F1/20 , G11C11/4078 , G06F11/07 , G06F11/30
摘要： A dual in-line memory module (DIMM) thermal control system for intelligent DIMM thermal controls for maximum uptime may include a memory subsystem. The memory subsystem may include a first DIMM and a first serial presence detect (SPD) module associated with the first DIMM. The DIMM thermal control system may also include a baseboard management controller (BMC). The BMC may, when a first DIMM failure of the first DIMM may be detected, record a first failure event in a first failure events log of the first SPD module. The first failure event may comprise the first DIMM failure and associated first thermal telemetry data of the first DIMM. The BMC may also adjust DIMM thermal control settings to reduce temperature of the first DIMM based on the first failure events log including at least the first failure event.
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公开(公告)号：US10353446B2
公开(公告)日：2019-07-16
申请号：US15707649
申请日：2017-09-18
申请人： DELL PRODUCTS L.P.
摘要： Systems and methods of adaptive thermal control are provided for information handling system platforms that may be implemented to automate and scale fan control settings by making the fan control settings relative to a reported component thermal control parameter value from a component of an information handling system platform, such as a CPU or other heat generating component. In one example, bounds for system use of vendor or component manufacturer-reported thermal control parameter values may be set for system cooling so as to confine use of these values within information handling system platform limits characterized by a manufacturer of an information handling system platform.
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8.发明授权公开(公告)号：US10353357B2
公开(公告)日：2019-07-16
申请号：US14747801
申请日：2015-06-23
申请人： Dell Products L.P.
摘要： In accordance with embodiments of the present disclosure, an information handling system may include a processor and an air mover control system for controlling at least one air mover configured to drive airflow to one or more components of the information handling system. The air mover control system may be configured to read from an information handling resource of the information handling system, wherein the information handling resource comprises an active cooling system, a fault condition cooling requirement defining a minimum airflow required by the information handling resource from the at least one air mover in presence of a fault condition of the active cooling system. The air mover control system may also be configured to read from the information handling resource a variable indicating whether the fault condition of the active cooling system exists. The air mover control system may also be configured to, responsive to the variable indicating the fault condition exists, determine a speed for the at least one air mover to satisfy the fault condition cooling requirement and cause the at least one air mover to operate at the speed.
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9.发明授权公开(公告)号：US10254807B2
公开(公告)日：2019-04-09
申请号：US15180976
申请日：2016-06-13
申请人： Dell Products L.P.
摘要： In accordance with embodiments of the present disclosure, a management controller for use in an information handling system may include a processor configured to manage a plurality of air mover control systems for a plurality of air movers integral to the information handling system, each air mover of the plurality of air movers associated with a corresponding zone of the information handling system and a co-processor configured to, in the event of a fault condition of the processor, manage the plurality of air mover control systems in accordance with a per-zone policy.
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公开(公告)号：US20180359882A1
公开(公告)日：2018-12-13
申请号：US15618885
申请日：2017-06-09
申请人： Dell Products, L.P.
发明人： Dominick Lovicott , Hasnain Shabbir
CPC分类号： H05K7/20836 , G05B15/02 , H05K7/20727
摘要： Method, systems are provided for providing automated open-loop control of an airflow cooling system in an IHS (Information Handling System), where the open-loop control is automatically adjusted based on changes to the components installed by the IHS. An airflow impedance, providing an amount a component physically impedes airflow, is retrieved for a new component. An estimated airflow delivery to the installed location of the new component is determined and scaled based on the airflow impedance of the new component and based on the ability to bypass the new component with ventilated airflow. An airflow delivery target for the new component is determined based on the ambient air temperature available at the installed new component. The airflow delivery target is scaled based on the installed location of the new component. The airflow cooling system is operated to equalize the estimated airflow delivery to the new component with the airflow delivery target for new component.
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