System and method for thermal control in a modular chassis

    公开(公告)号:US10779435B2

    公开(公告)日:2020-09-15

    申请号:US16243442

    申请日:2019-01-09

    IPC分类号: H05K7/20 G06F1/20

    摘要: An information handling system includes a rear node that includes an airflow control device a thermal manager. The thermal manager identifies a front node mating event between the rear node and a front node; in response to the front node mating event: obtains front node airflow characteristics for the front node; determines an airflow rate using, at least in part, the front node airflow characteristics; and sets an operating point of the airflow control device based on the airflow rate.

    Liquid Cooling Manifold for Information Technology Equipment

    公开(公告)号:US20240032241A1

    公开(公告)日:2024-01-25

    申请号:US17813620

    申请日:2022-07-20

    IPC分类号: H05K7/20

    摘要: An information technology equipment enclosure comprises a plurality of IT components, cold plates disposed over at least two of the IT components, and a cooling fluid manifold disposed within the IT equipment enclosure. The coolant liquid manifold has multiple input connectors and multiple output connectors. Each of the cold plates are coupled to the cooling fluid manifold using a coolant line attached to one of the input connectors and a coolant line attached to one of the output connectors. An input cooling liquid line couples the coolant liquid manifold to an output of an external liquid cooling system, and an output liquid line couples the coolant liquid manifold to an input of the external liquid cooling system. The coolant liquid manifold is configured to receive cooling fluid from the external liquid cooling system and to distribute the cooling fluid to all of the cold plates via the input connectors.

    Leak sensor drip tray
    3.
    发明授权

    公开(公告)号:US11310938B2

    公开(公告)日:2022-04-19

    申请号:US16896720

    申请日:2020-06-09

    IPC分类号: H05K7/20 G01M3/32 G06F1/20

    摘要: Systems and methods are provided for a leak sensor drip tray. In some embodiments, an Information Handling System (IHS) may include: a component; a cold plate disposed above the component; a leak sensor board disposed above the cold plate; and a drip tray disposed above the leak sensor, wherein the drip tray is configured to capture a fluid leak from a fitting coupled to the cold plate.

    LEAK SENSOR DRIP TRAY
    4.
    发明申请

    公开(公告)号:US20210385970A1

    公开(公告)日:2021-12-09

    申请号:US16896720

    申请日:2020-06-09

    IPC分类号: H05K7/20 G06F1/20 G01M3/32

    摘要: Systems and methods are provided for a leak sensor drip tray. In some embodiments, an Information Handling System (IHS) may include: a component; a cold plate disposed above the component; a leak sensor board disposed above the cold plate; and a drip tray disposed above the leak sensor, wherein the drip tray is configured to capture a fluid leak from a fitting coupled to the cold plate.

    SYSTEM AND METHOD FOR THERMAL CONTROL IN A MODULAR CHASSIS

    公开(公告)号:US20200221603A1

    公开(公告)日:2020-07-09

    申请号:US16243442

    申请日:2019-01-09

    IPC分类号: H05K7/20 G06F1/20

    摘要: An information handling system includes a rear node that includes an airflow control device a thermal manager. The thermal manager identifies a front node mating event between the rear node and a front node; in response to the front node mating event: obtains front node airflow characteristics for the front node; determines an airflow rate using, at least in part, the front node airflow characteristics; and sets an operating point of the airflow control device based on the airflow rate.