公开(公告)号：US20080290430A1

公开(公告)日：2008-11-27

申请号：US11753851

申请日：2007-05-25

Applicant: Dave S. Mahadevan ,  Daniel N. Koury, JR.

Inventor： Dave S. Mahadevan ,  Daniel N. Koury, JR.

IPC: H01L29/84 ,  H01L21/52

CPC classification number: B81B7/0048 ,  B81B2201/0235

Abstract: A stress-isolated MEMS device (14) includes a platform (26) suspended over a substrate wafer (24). In one embodiment, the platform (26) is suspended by springs (38), but other suspension techniques may also be used. A transducer (28) is formed over the platform (26). The transducer (28) includes immovable portions (50) and movable portions (52). The transducer (28) and platform (26) are sealed within a cavity (62) formed within a cap support (30) between a cap wafer (32) and the substrate wafer (24). A leadframe (22) is affixed to the substrate wafer (24). The cap wafer (32) and other portions of the device (14) become embedded in a package material (20) so that a substantially solid boundary forms between the cap wafer (32) and the package material (20).

Abstract translation: 应力隔离MEMS器件（14）包括悬挂在衬底晶片（24）上的平台（26）。 在一个实施例中，平台（26）由弹簧（38）悬挂，但也可以使用其它悬挂技术。 传感器（28）形成在平台（26）上方。 换能器（28）包括不可移动部分（50）和可移动部分（52）。 传感器（28）和平台（26）被密封在形成在盖子晶片（32）和基板晶片（24）之间的盖支撑件（30）内的空腔（62）内。 引线框架（22）固定到基板晶片（24）上。 封盖晶片（32）和器件（14）的其它部分变得嵌入封装材料（20）中，使得在盖晶片（32）和封装材料（20）之间形成基本上固体的边界。

公开(公告)号：US20090293617A1

公开(公告)日：2009-12-03

申请号：US12130702

申请日：2008-05-30

Applicant: Andrew C. McNeil ,  Aaron A. Geisberger ,  Daniel N. Koury, JR. ,  Gary G. Li

Inventor： Andrew C. McNeil ,  Aaron A. Geisberger ,  Daniel N. Koury, JR. ,  Gary G. Li

IPC: G01P15/125

CPC classification number: B81B3/0072 ,  B81B2201/0235 ,  B81B2203/0109 ,  B81B2203/0136 ,  G01P1/006 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0814 ,  G01P2015/082

Abstract: A microelectromechanical systems (MEMS) sensor (52) includes a substrate (62) a movable element (58) spaced apart from the substrate (62), suspension anchors (66, 68, 70, 72) formed on the substrate (62), and compliant members (74) interconnecting the movable element (58) with the suspension anchors. The MEMS sensor (52) further includes fixed fingers (76) and fixed finger anchors (78) attaching the fixed fingers (76) to the substrate (62). The movable element (58) includes openings (64). At least one of the suspension anchors resides in at least one of the multiple openings (64) and pairs (94) of the fixed fingers (76) reside in other multiple openings (64). The MEMS sensor (52) is symmetrically formed, and a location of the fixed finger anchors (78) defines an anchor region (103) within which the suspension anchors (66, 68, 70, 72) are positioned.

Abstract translation: 微机电系统（MEMS）传感器（52）包括基板（62），与基板（62）间隔开的可移动元件（58），形成在基板（62）上的悬挂锚固件（66,68,70,72） 以及将可移动元件（58）与悬挂锚固件互连的柔性构件（74）。 MEMS传感器（52）还包括将固定指状物（76）附接到基底（62）的固定指状物（76）和固定指状锚（78）。 可移动元件（58）包括开口（64）。 悬挂锚中的至少一个驻留在多个开口（64）中的至少一个中，固定指状物（76）的对（94）位于其它多个开口（64）中。 MEMS传感器（52）对称地形成，并且固定指状物锚定件（78）的位置限定了锚定区域（103），悬挂锚固件（66,68,70,72）定位在锚定区域内。

公开(公告)号：US20090218642A1

公开(公告)日：2009-09-03

申请号：US12040737

申请日：2008-02-29

Applicant: Melvy F. Miller ,  Daniel N. Koury, JR. ,  Lianjun Liu

Inventor： Melvy F. Miller ,  Daniel N. Koury, JR. ,  Lianjun Liu

IPC: H01L29/84 ,  H01L21/00

CPC classification number: B81C1/00182 ,  B81B2201/0257 ,  B81C2201/019 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00

Abstract: A microelectromechanical systems (MEMS) component 20 includes a portion 32 of a MEMS structure 30 formed on a semiconductor substrate 34 and a portion 36 of the structure 30 formed in a non-semiconductor substrate 22. The non-semiconductor substrate 22 is in fixed communication with the semiconductor substrate 34 with the portion 32 of the MEMS structure 30 being interposed between the substrates 34 and 22. A fabrication method 96 entails utilizing semiconductor thin-film processing techniques to form the portion 32 on the semiconductor substrate 34, and utilizing a lower cost processing technique to fabricate the portion 36 in the non-semiconductor substrate 22. The portions 32 and 36 are coupled to yield the MEMS structure 30, and the MEMS structure 30 can be attached to another substrate as needed for additional functionality.

Abstract translation: 微机电系统（MEMS）部件20包括形成在半导体衬底34上的MEMS结构30的部分32和形成在非半导体衬底22中的结构30的部分36.非半导体衬底22处于固定通信 其中半导体衬底34与MEMS结构30的部分32插入在衬底34和22之间。制造方法96需要利用半导体薄膜处理技术在半导体衬底34上形成部分32，并且利用较低的 成本处理技术以制造非半导体衬底22中的部分36.部分32和36被耦合以产生MEMS结构30，并且可以根据需要将MEMS结构30附接到另一衬底以用于附加功能。

公开(公告)号：US20100301706A1

公开(公告)日：2010-12-02

申请号：US12472506

申请日：2009-05-27

Applicant: Daniel N. Koury, JR.

Inventor： Daniel N. Koury, JR.

IPC: G01L1/16

CPC classification number: G01L1/16 ,  G01L9/008

Abstract: A differential piezoelectric sensor (20) includes a suspended structure (24) coupled to a substrate (22). The suspended structure (24) has at least one location (44) in a first stress state (70) and at least one location (46) in a second stress state (72) when the suspended structure (24) is in a stress position (69). Piezoelectric elements (26) are located on the suspended structure (24) at the locations (44), each producing a signal (78) in response to mechanical stress (68) experienced by the suspended structure (24). In addition, piezoelectric elements (28) are formed on the suspended structure (24) at the locations (46), each producing a signal (80) in response to the mechanical stress (68). The piezoelectric elements (26, 28) are electrically connected to combine the signals (78, 80) so as to obtain a signal (76) representative of the mechanical stress (68) experienced by the suspended structure (24).

Abstract translation: 差动压电传感器（20）包括耦合到衬底（22）的悬挂结构（24）。 当悬挂结构（24）处于应力位置时，悬挂结构（24）具有处于第一应力状态（70）的至少一个位置（44）和处于第二应力状态（72）的至少一个位置（46​​） （69）。 压电元件（26）在位置（44）处位于悬挂结构（24）上，每个产生响应于悬挂结构（24）经历的机械应力（68）的信号（78）。 此外，压电元件（28）在位置（46​​）处的悬置结构（24）上形成，每个产生响应于机械应力（68）的信号（80）。 压电元件（26,28）电连接以组合信号（78,80），以便获得代表由悬挂结构（24）经历的机械应力（68）的信号（76）。