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公开(公告)号：US09478674B2
公开(公告)日：2016-10-25
申请号：US13896853
申请日：2013-05-17
申请人： DSM IP ASSETS B.V.
发明人： Koichi Kumai , Ryuji Ueda , Kentaro Kubota , Shigeki Kudo , Minoru Kawasaki
CPC分类号： H01L31/02008 , H01L31/02021 , H01L31/0516 , H05K1/02 , H05K1/181 , H05K3/20 , H05K3/202 , H05K2201/10143 , H05K2203/0221 , H05K2203/033 , H05K2203/1545 , Y02E10/50 , Y10T29/49156 , Y10T156/1002
摘要： A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.
摘要翻译： 一种制造电路板的方法包括：通过切割保持在保持片上的金属箔来除去金属箔的一部分，在保持片上形成多个金属电极以彼此分离; 在所述多个金属电极的表面上形成粘合剂层; 通过使粘合剂层与基材紧密接触，将粘合剂层粘合到基材上; 以及通过从多个金属电极分离保持片，将粘合剂层和多个金属电极转印到基材上。
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公开(公告)号：US10651320B2
公开(公告)日：2020-05-12
申请号：US16401443
申请日：2019-05-02
申请人： DSM IP Assets, B.V.
发明人： Koichi Kumai , Ryuji Ueda , Kentaro Kubota , Shigeki Kudo , Minoru Kawasaki
摘要： A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.
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