发明授权
- 专利标题： Method of manufacturing a circuit board by punching
- 专利标题（中）： 通过冲压制造电路板的方法
-
申请号： US13896853申请日： 2013-05-17
-
公开(公告)号： US09478674B2公开(公告)日： 2016-10-25
- 发明人: Koichi Kumai , Ryuji Ueda , Kentaro Kubota , Shigeki Kudo , Minoru Kawasaki
- 申请人： DSM IP ASSETS B.V.
- 申请人地址： NL Heerlen
- 专利权人： DSM IP ASSETS B.V.
- 当前专利权人： DSM IP ASSETS B.V.
- 当前专利权人地址： NL Heerlen
- 代理机构： Nixon & Vanderhye P.C.
- 优先权： JP2010-259186 20101119; JP2011-069309 20110328; JP2011-126519 20110606
- 主分类号： H05K3/02
- IPC分类号： H05K3/02 ; H01L31/02 ; H05K3/20 ; H05K1/02 ; H01L31/05
摘要：
A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.
公开/授权文献
信息查询
