公开(公告)号：US10861712B2

公开(公告)日：2020-12-08

申请号：US15957369

申请日：2018-04-19

申请人： DISCO CORPORATION

发明人： Tsubasa Obata

IPC分类号： H01L21/683 ,  H01L21/48 ,  H01L23/00

摘要： A processing method for a plate-shaped workpiece that has a transparent substrate, a first resin layer stacked on a front surface of the substrate, and a second resin layer stacked on a back surface of the substrate and in which the first resin layer is segmented into plural regions by plural planned dividing lines that intersect each other, includes sticking an expandable adhesive tape to the second resin layer, irradiating the workpiece with a laser beam with such a wavelength as to be absorbed by the first resin layer and transmitted through the transparent substrate, the laser beam removing the first resin layer along the planned dividing lines by ablation, the laser beam also forming a modified layer whose refractive index or mechanical strength is different from surroundings along the planned dividing lines.

公开(公告)号：US10796926B2

公开(公告)日：2020-10-06

申请号：US16034630

申请日：2018-07-13

申请人： DISCO CORPORATION

发明人： Tsubasa Obata ,  Satoshi Kumazawa

IPC分类号： H01L21/48 ,  H01L23/498 ,  C03B33/033 ,  C03B33/02 ,  C03B33/07 ,  B23K26/364 ,  B23K26/00 ,  B23K26/08 ,  H01L23/15 ,  B23K26/402 ,  B23K26/53 ,  B23K103/00 ,  B23K101/42 ,  B23K101/40 ,  B23K103/16

摘要： In a method of manufacturing a glass interposer, first, stacked bodies formed on a front surface and a back surface of a glass substrate are processed along division lines (streets) to form first grooves having a first width and such a depth as not to reach the glass substrate, while leaving a residual resin portion at bottoms of the first grooves. Thereafter, the residual resin portion is subjected to ablation processing to expose the front surface and the back surface of the glass substrate, thereby forming second grooves having a second width narrower than the first width. A laser beam is applied along the division lines through the second grooves to form modified layers in the inside of the glass substrate, and an external force is exerted on the glass substrate to divide the glass substrate, with the modified layers as division starting points.

公开(公告)号：US20160111331A1

公开(公告)日：2016-04-21

申请号：US14882990

申请日：2015-10-14

申请人： DISCO CORPORATION

发明人： Yuki Ogawa ,  Kensuke Nagaoka ,  Tsubasa Obata ,  Yuri Ban

IPC分类号： H01L21/78 ,  H01L21/683

CPC分类号： H01L21/78 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68386

摘要： A wafer is divided into individual devices along division lines formed on the front side of the wafer. A protective tape having an adhesive layer is attached to the front side of a functional layer of the wafer with the adhesive layer of the protective tape in contact with the front side of the functional layer. The wafer with the protective tape is held on a holding surface of a chuck table with the protective tape in contact with the holding surface. A laser beam having an absorption wavelength to the substrate and the functional layer of the wafer is applied from the back side of the substrate along each division line to form a laser processed groove having a depth reaching the protective tape along each division line, thereby dividing the wafer into individual device chips corresponding to the individual devices.

摘要翻译： 沿着形成在晶片的前侧上的分割线将晶片分成单个器件。 具有粘合剂层的保护带被附着到晶片的功能层的正面，保护带的粘合层与功能层的正面相接触。 具有保护带的晶片被保持在卡盘台的保持表面上，保护带与保持表面接触。 从基板的背面沿着各分割线施加具有对基板的吸收波长的激光束和晶片的功能层，以形成沿着分割线到达保护带的深度的激光加工槽，从而分割 晶片成为与各个器件对应的单独器件芯片。

公开(公告)号：US09779993B2

公开(公告)日：2017-10-03

申请号：US14882990

申请日：2015-10-14

申请人： DISCO CORPORATION

发明人： Yuki Ogawa ,  Kensuke Nagaoka ,  Tsubasa Obata ,  Yuri Ban

IPC分类号： H01L21/683 ,  H01L21/67 ,  H01L21/78

CPC分类号： H01L21/78 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68386

摘要： A method for dividing a wafer including: attaching a protective tape to a functional layer of the wafer with the adhesive layer of the tape in contact with the functional layer; and a wafer dividing step. The dividing step includes a cut groove forming step and a laser processing step. The cut groove forming step uses a blade to form a cut groove with a depth that does not reach the functional layer, resulting in part of the substrate being left along each division line. The laser processing step includes applying a laser beam to the part of the substrate left after the cut groove forming step and the functional layer of the wafer to form a laser processed groove having a depth reaching the tape. The tape is closely attached to the functional layer during the tape attaching step to prevent the adhesion of debris to the devices.

公开(公告)号：US09455149B2

公开(公告)日：2016-09-27

申请号：US14637854

申请日：2015-03-04

申请人： DISCO CORPORATION

发明人： Yuki Ogawa ,  Yuki Ishida ,  Tsubasa Obata

IPC分类号： H01L21/268 ,  H01L21/78 ,  H01L21/67 ,  B23K26/00 ,  B23K26/03 ,  B23K26/08

CPC分类号： H01L21/268 ,  B23K26/032 ,  B23K26/0622 ,  B23K26/0853 ,  B23K26/53 ,  H01L21/67092 ,  H01L21/78

摘要： A plate-like object processing method for processing a plate-like object including a substrate and a laminate formed on a front surface of the substrate, includes a substrate exposing step of exposing the substrate by removing the laminate by irradiating a region in which the laminate of the plate-like object is desired to be removed with a laser beam set at an energy density that destroys the laminate but does not destroy the substrate.

摘要翻译： 一种用于处理包括基板和形成在基板的前表面上的层叠体的板状物体的板状物体处理方法，包括：基板曝光步骤，通过照射层叠体的区域除去层压体来曝光基板; 期望用激光束去除板状物体，该激光束以能量密度设置，破坏层压板但不破坏基板。

公开(公告)号：US20160027696A1

公开(公告)日：2016-01-28

申请号：US14805037

申请日：2015-07-21

申请人： DISCO CORPORATION

发明人： Kensuke Nagaoka ,  Yuki Ogawa ,  Tsubasa Obata ,  Yuri Ban

IPC分类号： H01L21/78 ,  H01L21/66 ,  H01L21/683

CPC分类号： H01L21/78 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L22/12 ,  H01L2221/68327 ,  H01L2221/6834

摘要： A wafer has a substrate, a functional layer and division lines. The wafer is held on a chuck table with a protective member attached to the front side of the functional layer in contact with the chuck table. The height of the back side of the wafer is detected in a Z direction along each division line while moving the chuck table in an X direction. An X coordinate is recorded for each division line, as well as a corresponding Z coordinate. A cutting blade is positioned on the back side of the wafer and moved in the Z direction according to the recorded X and Z coordinates while moving the chuck table in the X direction to thereby form a cut groove having a depth not reaching the functional layer, with a part of the substrate left between the bottom of the cut groove and the functional layer.

摘要翻译： 晶片具有基板，功能层和分割线。 将晶片保持在卡盘台上，其中保护构件附接到与卡盘台接触的功能层的前侧。 在沿X方向移动卡盘台的同时沿着各分割线在Z方向上检测晶片背面的高度。 记录每个分割线的X坐标以及相应的Z坐标。 切割刀片位于晶片的背面，并沿X方向移动卡盘台时根据记录的X和Z坐标在Z方向移动，从而形成深度未到达功能层的切割槽， 其中一部分衬底留在切槽的底部和功能层之间。

公开(公告)号：US20180130709A1

公开(公告)日：2018-05-10

申请号：US15799282

申请日：2017-10-31

申请人： DISCO CORPORATION

发明人： Yohei Yamashita ,  Tsubasa Obata ,  Yuki Ogawa

IPC分类号： H01L21/78 ,  H01L23/544 ,  H01L21/683 ,  H01L21/268

摘要： A wafer processing method includes a protective member laying step of placing a protective member on a face side of a wafer, a reverse side grinding step of grinding a reverse side of the wafer to thin the wafer, a cut groove forming step of positioning a cutting blade in alignment with projected dicing lines one at a time on the reverse side of the wafer, cutting the wafer with the cutting blade to form cut grooves in the wafer which terminate short of the face side thereof, and a cutting step of applying a laser beam to the wafer from the reverse side thereof along the cut grooves to completely sever the wafer along the projected dicing lines into individual device chips.

公开(公告)号：US20180122700A1

公开(公告)日：2018-05-03

申请号：US15799567

申请日：2017-10-31

申请人： DISCO CORPORATION

发明人： Yohei Yamashita ,  Tsubasa Obata ,  Yuki Ogawa

IPC分类号： H01L21/78 ,  H01L21/268 ,  H01L21/683

CPC分类号： H01L21/78 ,  H01L21/2686 ,  H01L21/6836 ,  H01L2221/68327

摘要： A wafer processing method divides a wafer into individual device chips along division lines. The method includes attaching an adhesive tape to the front side of the wafer and attaching a peripheral portion of the adhesive tape to an annular frame having an inside opening for receiving the wafer, thereby supporting the wafer through the adhesive tape to the annular frame; grinding the back side of the wafer to reduce the thickness of the wafer; cutting the back side of the wafer along each division line by using a cutting blade to form a cut groove having a depth not reaching the front side of the wafer; and applying a laser beam to the bottom of the cut groove from the back side of the wafer along each division line to divide the wafer to obtain the individual device chips.

公开(公告)号：US09953871B2

公开(公告)日：2018-04-24

申请号：US15341624

申请日：2016-11-02

申请人： DISCO CORPORATION

发明人： Tsubasa Obata ,  Yohei Yamashita

IPC分类号： H01L21/78 ,  H01L21/302 ,  H01L21/304 ,  H01L21/56 ,  H01L21/683 ,  H01L23/31 ,  H01L21/268

CPC分类号： H01L21/78 ,  H01L21/268 ,  H01L21/302 ,  H01L21/304 ,  H01L21/565 ,  H01L21/6836 ,  H01L23/3114 ,  H01L23/3185 ,  H01L2221/68327 ,  H01L2221/6834

摘要： A laser beam is applied to the front side of a wafer along division lines, to form grooves having a depth corresponding to a finished thickness of device chips. Molding resin is laid on the front side of the wafer and embedded in the grooves. A protective member is attached to a front side of the molding resin, and a back side of the wafer is ground to expose the grooves and to expose the molding resin embedded in the grooves on the back side of the wafer. The wafer is divided along the grooves by a cutting blade having a thickness smaller than the width of the grooves, a central portion in a width direction of the molding resin being exposed along the grooves, thereby dividing the wafer into individual device chips each having a periphery surrounded with the molding resin.

公开(公告)号：US20170117434A1

公开(公告)日：2017-04-27

申请号：US15335728

申请日：2016-10-27

申请人： DISCO CORPORATION

发明人： Yuki Ogawa ,  Yohei Yamashita ,  Tsubasa Obata

IPC分类号： H01L31/18 ,  H01L21/304 ,  H01L21/268 ,  H01L21/683 ,  H01L21/78

CPC分类号： H01L21/304 ,  H01L21/2686 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834

摘要： A wafer processing method for dividing a wafer (including a substrate and a functional layer formed on the front side of the substrate) along a plurality of division lines. The functional layer is partitioned by the division lines to define a plurality of regions. The method includes the following steps: attaching a protective member to the front side of the wafer; cutting the back side of the substrate of the wafer in an area corresponding to each division line with a cutting blade, thereby forming a division groove having a depth not reaching the functional layer so that a part of the substrate is left in this area; applying a laser beam to the wafer from the back side of the substrate along the bottom of each division groove extending along each division line to thereby cut the part of the substrate and the functional layer along each division line.