公开(公告)号：US11231295B2

公开(公告)日：2022-01-25

申请号：US16924366

申请日：2020-07-09

申请人： DENSO CORPORATION

发明人： Yoshinori Inuzuka ,  Yoshiyuki Kono

IPC分类号： G01R15/20 ,  G01D5/14 ,  G01B7/30 ,  G01D11/24 ,  G01R33/07

摘要： A rotation angle detection device for detecting a rotation angle of a rotating body includes a magnet having poles arranged along a radial direction perpendicular to a rotation axis of the rotating body, the magnet being disposed to rotate together with the rotating body, a magnetic portion provided in a ring shape radially outward of the magnet, a plurality of gaps being formed in the magnetic portion at a plurality of locations along a circumferential direction, and a magnetic detection unit arranged in a particular gap of the plurality of gaps, the magnetic detection unit being configured to detect a tangential magnetic flux component in a tangential direction and a radial magnetic flux component in the radial direction of a magnetic field.

公开(公告)号：US11162814B2

公开(公告)日：2021-11-02

申请号：US16264851

申请日：2019-02-01

申请人： DENSO CORPORATION

发明人： Takeshi Ito ,  Takamitsu Kubota ,  Yoshiyuki Kono

IPC分类号： G01D5/14 ,  G01D5/16 ,  G01D3/08

摘要： A position detecting device includes an IC package, a first terminal line, a ground terminal line, a power supply terminal line, a second terminal line, a bypass terminal line, motor terminal lines, and a connector portion. A bypass terminal line is positioned on an opposite side of the ground terminal line across the first terminal line or the second terminal line and is connected to a bypass portion of the ground terminal line which connects to the ground connection portion. In the connector portion, the motor terminal line, the bypass terminal line, the second terminal line, the power supply terminal line, and the first terminal line are placed in this order.

公开(公告)号：US11112464B2

公开(公告)日：2021-09-07

申请号：US16892791

申请日：2020-06-04

申请人： DENSO CORPORATION

发明人： Takasuke Ito ,  Yoshiyuki Kono ,  Tomoyuki Takiguchi

IPC分类号： G01R31/40 ,  G01R31/52

摘要： An output terminal of a signal output device is connected through a branch path to a voltage dividing point in a main path, and transmits an output signal based on a voltage of the voltage dividing point to an outside. A signal generation circuit adjusts the voltage of the voltage dividing point and generates the output signal. A short circuit detection circuit detects a short circuit between the output terminal and another terminal when a current flowing in the branch path is greater than a predetermined short circuit detection threshold. A switching circuit switches a current carrying capacity or a configuration of the signal generation circuit to limit a short circuit current flowing in the branch path when the short circuit is detected. The short circuit current is set to a value equal to or greater than the short circuit detection threshold and less than a current upper limit value.

公开(公告)号：US10539430B2

公开(公告)日：2020-01-21

申请号：US16067654

申请日：2016-12-16

申请人： DENSO CORPORATION

发明人： Hitomi Honda ,  Yoshiyuki Kono ,  Hirofumi Hagio

IPC分类号： G01B7/30 ,  G01D5/14 ,  G01D11/24 ,  G01B7/00 ,  G01B7/14 ,  G01B11/02 ,  G01D5/12 ,  G01R33/09 ,  G01R33/00

摘要： A sensor of a position detecting device includes a sensor body, a magnetic detector, and at least one engagement protrusion that extends from a position in the vicinity of the magnetic detector. The engagement protrusion engages with an engagement hole disposed on a casing. An anti-rotation hole is disposed on the casing in a position spaced apart from the engagement hole. An anti-rotation pin is disposed on the sensor body, and engages with the anti-rotation hole to prevent the casing and the sensor body from rotating relatively to each other about the engagement hole. At least a part of the engagement protrusion is in contact with an inner wall of the engagement hole on a straight line L connecting a center of the magnetic detector and a center of the anti-rotation pin.

公开(公告)号：US09322670B2

公开(公告)日：2016-04-26

申请号：US14190626

申请日：2014-02-26

申请人： DENSO CORPORATION

发明人： Takehito Mizunuma ,  Tomoyuki Takiguchi ,  Takamitsu Kubota ,  Yoshiyuki Kono

IPC分类号： G01B7/30 ,  G01D5/14 ,  G01D5/244

CPC分类号： G01D5/14 ,  G01D5/145 ,  G01D5/2448

摘要： A magnetism sensing element is provided to be rotatable relative to permanent magnets and outputs a magnetic force detection value, which corresponds to a perpendicular component of magnetic flux. A Hall IC calculates and outputs an output voltage, which corresponds to a relative rotational angle between the permanent magnets and the magnetism sensing element, based on the magnetic force detection value outputted by the magnetism sensing element. The Hall IC calculates the output voltage as V2=k×arcsin(V1/(VM+α))+Voffset, in which V1, V2, VM, k, α and Voffset indicate the magnetic force detection value, the output voltage, a maximum value of the magnetic force detection value, a gain, a predetermined value and a predetermined offset value.

摘要翻译： 磁传感元件能够相对于永磁体旋转，并输出对应于磁通的垂直分量的磁力检测值。 霍尔IC基于由磁感测元件输出的磁力检测值来计算并输出与永磁体和磁感测元件之间的相对旋转角度对应的输出电压。 霍尔IC计算输出电压为V2 = k×arcsin（V1 /（VM +α））+ Voffset，其中V1，V2，VM，k，α和Voffset表示磁力检测值，输出电压a 磁力检测值的最大值，增益，预定值和预定的偏移值。

公开(公告)号：US09129067B2

公开(公告)日：2015-09-08

申请号：US13683364

申请日：2012-11-21

申请人： DENSO CORPORATION

发明人： Takamitsu Kubota ,  Tohru Shimizu ,  Tetsuya Hara ,  Yoshiyuki Kono

IPC分类号： G06F17/40 ,  G01D5/14 ,  G01D5/244 ,  B60W50/023 ,  B60K26/04

CPC分类号： G06F17/40 ,  B60K26/04 ,  B60K2026/046 ,  B60W50/023 ,  B60W2510/0604 ,  B60W2540/10 ,  G01D5/145 ,  G01D5/24447 ,  G01D5/24476

摘要： In a position detector for detecting a position of a detection body, a signal processing circuit processes a signal outputted from a magnetic field detection element. A first storage circuit stores the signal outputted from the magnetic field detection element and outputs a signal to an external device through an output circuit in a normal operation mode. A second storage circuit stores an output value of the first storage circuit. When a malfunction determination circuit determines an instantaneous power interruption mode, a signal route changing circuit prevents a signal transmission between the first storage circuit and the second storage circuit and a signal transmission between the first storage circuit and the output circuit, prevents the second storage circuit from updating data for a certain period of time, and permits the second storage circuit in which updating is prevented to output a signal to the output circuit.

摘要翻译： 在用于检测检测体的位置的位置检测器中，信号处理电路处理从磁场检测元件输出的信号。 第一存储电路存储从磁场检测元件输出的信号，并通过输出电路在正常运行模式下将信号输出到外部装置。 第二存储电路存储第一存储电路的输出值。 当故障确定电路确定瞬时功率中断模式时，信号路由改变电路防止第一存储电路和第二存储电路之间的信号传输以及第一存储电路和输出电路之间的信号传输，防止第二存储电路 从更新数据一段时间，并允许防止更新的第二存储电路向输出电路输出信号。

公开(公告)号：US20140333297A1

公开(公告)日：2014-11-13

申请号：US14263230

申请日：2014-04-28

申请人： DENSO CORPORATION

发明人： Seiji Nishimoto ,  Yoshiyuki Kono ,  Ninh Duc Hoang

IPC分类号： G01D5/12

CPC分类号： G01D5/12 ,  G01D5/142 ,  G01D5/145 ,  G01D5/2033 ,  G01D5/2241 ,  G04C5/00 ,  H02K49/102

摘要： A magnetic flux emission unit is mounted on a detection object and rotatable integrally with the detection object. An IC package includes a magnetism detection element, which sends a signal according to change in a magnetic flux caused when the magnetic flux emission unit rotates. A cover member includes a bottom portion and a tubular portion. The tubular portion is extended from an outer periphery of the bottom portion. The cover member surrounds the magnetic flux emission unit with the bottom portion when mounted to the housing. A support portion is projected from the bottom portion toward an opening of the tubular portion to support the IC package. A projection is projected toward the opening from the bottom portion to at least a position corresponding to the magnetism detection element.

摘要翻译： 磁通发射单元安装在检测对象上并与检测对象一体地旋转。 IC封装包括磁检测元件，其根据磁通发射单元旋转引起的磁通量的变化发送信号。 盖构件包括底部和管状部分。 管状部分从底部的外周延伸。 当安装到壳体时，盖构件围绕具有底部的磁通发射单元。 支撑部分从底部突出到管状部分的开口以支撑IC封装。 突起从底部突出到开口，至少对应于磁性检测元件的位置。

公开(公告)号：US11268803B2

公开(公告)日：2022-03-08

申请号：US16263148

申请日：2019-01-31

申请人： DENSO CORPORATION

发明人： Takuma Uchida ,  Yoshiyuki Kono

IPC分类号： G01B7/30 ,  G01D5/14 ,  G01D11/24 ,  G01D5/12

摘要： The present disclosure provides a position detection device including an IC package, a terminal line and a sensor housing. The IC package includes a magnetic detection element, a sealing portion sealing the magnetic detection element, and a lead line protruding from the sealing portion and electrically connected to the magnetic detection element. The lead line is fixed to the terminal line. The sensor housing is formed separately from the IC package and supports the terminal line.

公开(公告)号：US11892324B2

公开(公告)日：2024-02-06

申请号：US17204563

申请日：2021-03-17

申请人： DENSO CORPORATION

发明人： Takeshi Ito ,  Yoshiyuki Kono

IPC分类号： G01D5/12 ,  G01D11/24

CPC分类号： G01D5/12 ,  G01D11/245

摘要： A rotation angle sensor includes a sensor integrated circuit attached to an attachment member. The attachment member includes a connecting terminal protruding upward from an attachment surface and a guide protruding upward from the attachment surface and positions, together with the connecting terminal, the sensor integrated circuit at an attachment position. The sensor integrated circuit includes a lead frame on which an electronic circuit is mounted and an exterior covering the electronic circuit. The lead frame includes a lead and an extending portion located in an outer periphery of the exterior. At least one of the lead and the extending portion has an elastic structure. The sensor integrated circuit is attached to the attachment member by an elastic force of the elastic structure that biases the extending portion against the guide and that joins the lead to the connecting terminal.

公开(公告)号：US10115889B2

公开(公告)日：2018-10-30

申请号：US15603733

申请日：2017-05-24

申请人： DENSO CORPORATION ,  TDK-MICRONAS GMBH

发明人： Toshiyuki Koumori ,  Yoshiyuki Kono ,  Tomoyuki Takiguchi ,  Yoshinori Inuzuka ,  Akitoshi Mizutani ,  Seiji Nishimoto ,  Camillo Pilla

IPC分类号： H01L43/04 ,  H01L43/06 ,  H01L43/14

摘要： A method for manufacturing semiconductor devices is provided. The method includes bonding a semiconductor element to a first surface of a planar lead frame, clamping a partial area of the lead frame to hold the lead frame and the semiconductor element in molding dies, and covering at least a part of the lead frame and the semiconductor element with a resin member by resin molding which fills the molding dies with resin. A thin-walled portion having a relative small thickness is previously formed on a shortest virtual line connecting a clamp area of the lead frame to an area where the semiconductor element is bonded.