公开(公告)号：US20140347838A1

公开(公告)日：2014-11-27

申请号：US14283446

申请日：2014-05-21

申请人： DENSO CORPORATION

发明人： Toshihiro NAGAYA ,  Nobuhiko OKADA ,  Hiromasa HAYASHI

IPC分类号： H01L23/495 ,  H01L21/48

CPC分类号： H01L23/49524 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40245 ,  H01L2224/8385 ,  H01L2224/84385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/1305 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An electronic device includes first to third terminals and a clip. The clip includes first to third joint portions and a connection portion. The first to third joint portions correspond to and are bonded to the first to third terminals, respectively. The connection portion connects the first to third joint portions. One terminal in the first to third terminals has a depressed portion depressed to one side in a predetermined direction to store a conductive bonding material. A variation in positions of the first to third terminals in the predetermined direction is absorbed by deformation of the conductive bonding material when one joint portion in the first to third joint portions corresponding to the one terminal is bonded to the one terminal through the conductive bonding material.

摘要翻译： 电子设备包括第一至第三终端和剪辑。 夹子包括第一至第三接合部分和连接部分。 第一至第三接合部分别对应于并且分别结合到第一至第三端子。 连接部分连接第一至第三接合部分。 第一至第三端子中的一个端子具有在预定方向上向一侧凹陷的凹陷部分，以存储导电接合材料。 当对应于一个端子的第一至第三接头部分的一个接合部分通过导电接合材料接合到一个端子时，第一至第三端子在预定方向上的位置变化被导电接合材料的变形吸收 。

公开(公告)号：US20170135210A1

公开(公告)日：2017-05-11

申请号：US15318695

申请日：2015-09-14

申请人： DENSO CORPORATION

发明人： Tetsuto YAMAGISHI ,  Masayuki TAKENAKA ,  Toshihiro NAGAYA ,  Shinji HIRAMITSU

IPC分类号： H05K1/11 ,  H05K3/28 ,  B29C43/18 ,  H05K1/18 ,  B29C70/88 ,  B29C70/78

CPC分类号： H05K1/115 ,  B29C43/18 ,  B29C70/78 ,  B29C70/88 ,  B29L2031/3425 ,  H01L21/565 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K1/181 ,  H05K3/28 ,  H01L2924/00

摘要： A manufacturing method of an electronic device, including: a circuit board with a substrate through hole; a circuit element; and a resin mold with a mold through hole, using a first mold, a second mold having a cavity, and a pressing member protruding from a bottom of the cavity includes: fixing the circuit board to the first mold; fixing the second mold to the first mold to cover an opening of the substrate through hole by the pressing member; and forming the resin mold while covering the circuit element with the constituent material in the cavity. The circuit board is deformed by press-contacting the pressing member to the circuit board in a state where a part of the pressing member is inserted into the substrate through hole so that an opening area of the substrate through hole decreases toward a reverse surface from the one surface.

公开(公告)号：US20220115302A1

公开(公告)日：2022-04-14

申请号：US17557138

申请日：2021-12-21

申请人： DENSO CORPORATION

发明人： Akihiro FUKATSU ,  Noboru NAGASE ,  Toshihiro NAGAYA

IPC分类号： H01L23/495 ,  H01L25/07 ,  H01L25/16 ,  H05K1/18 ,  H02M7/537 ,  H02M1/08

摘要： A semiconductor device includes: first and second semiconductor elements each having two electrodes respectively disposed on two surfaces; two first terminals respectively connected to the two electrodes of the first semiconductor element and arranged side by side in one direction; two second terminals respectively connected to the two electrodes of the second semiconductor element, and arranged side by side in the one direction to be adjacent to the two first terminals; and a sealing resin portion covering the first and second semiconductor elements and the first and second terminals in a state where facing surfaces of the first and second terminals are exposed from the sealing resin portion. The facing surfaces of the two first terminals have different area ratios, the facing surfaces of the two second terminals have different area ratios, and one of the first terminals is arranged adjacent to both the two second terminals.

公开(公告)号：US20170330818A1

公开(公告)日：2017-11-16

申请号：US15527740

申请日：2015-12-11

申请人： DENSO CORPORATION

发明人： Tetsuto YAMAGISHI ,  Toshihiro NAGAYA ,  Masayuki TAKENAKA ,  Shinji HIRAMITSU

IPC分类号： H01L23/40 ,  H01L23/28 ,  H01L23/367 ,  H05K1/02

CPC分类号： H01L23/40 ,  H01L23/145 ,  H01L23/28 ,  H01L23/29 ,  H01L23/3121 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/4006 ,  H01L23/42 ,  H01L2023/405 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K3/284 ,  H05K2201/062 ,  H05K2201/068 ,  H05K2201/09136 ,  H05K2201/10166 ,  H05K2201/10409 ,  H01L2924/00

摘要： An electronic device includes: a resin substrate that includes insulation resin on which wiring made of conductive material is provided; a heat-generation element that is a circuit element mounted on a first surface of the resin substrate, and is operated to generate heat; and a sealing resin that is provided on the first surface, and seals the heat-generation element. An opposite surface of the sealing resin opposite to a surface of the sealing resin in contact with the first surface is thermally connected to a heat radiation member and mounted on the heat radiation member. Each of the resin substrate and the sealing resin has a bend shape convex toward the opposite surface when each of surrounding temperatures is a normal temperature and has a linear expansion coefficient for maintaining a bend shape convex toward the opposite surface when each of the surrounding temperatures is a high temperature.