公开(公告)号：US20170256510A1

公开(公告)日：2017-09-07

申请号：US15505273

申请日：2015-07-31

Applicant: DENSO CORPORATION

Inventor： Shotaro MIYAWAKI ,  Naohiko HIRANO ,  Akiyoshi ASAI ,  Yasutomi ASAI

IPC: H01L23/00

CPC classification number: H01L24/09 ,  H01L23/4334 ,  H01L23/49517 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/0612 ,  H01L2224/0912 ,  H01L2224/16104 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48499 ,  H01L2224/48507 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01046 ,  H01L2924/01033 ,  H01L2224/4554 ,  H01L2224/29099

Abstract: Electrode pads disposed on a first surface of a semiconductor element include a first pad located close to a corner and a second pad located apart from the corner compared with the first pad. A first wire connected to the first pad has a smaller Young's modulus than a second wire connected to the second pad. A thickness of an intermetallic compound layer formed by the first wire and the first pad is larger than a thickness of an intermetallic compound layer formed by the second wire and the second pad.