公开(公告)号：US20220385144A1

公开(公告)日：2022-12-01

申请号：US17818865

申请日：2022-08-10

Applicant: DENSO CORPORATION

Inventor： ATSUSHI SAITOU ,  TOMOAKI YOSHIMI

IPC: H02K11/30 ,  H02K5/22

Abstract: A drive device includes an electric motor and a control unit which are integrated together. The control unit is configured to control the electric motor by using an electric power supply and a signal supplied through an external cable. The control unit includes: a parent circuit board, which is installed to the electric motor; and a connector module, which is configured to connect the parent circuit board to an external connector of the external cable. The connector module includes: a connector portion that is configured to be coupled with and decoupled from the external connector; a wiring module that is configured to receive the electric power supply and the signal from the external cable through the connector portion; and a plurality of connecting conductors that electrically connect the wiring module to the parent circuit board.

公开(公告)号：US20220223501A1

公开(公告)日：2022-07-14

申请号：US17657064

申请日：2022-03-29

Applicant: DENSO CORPORATION

Inventor： SYUHEI MIYACHI ,  TOSHIHIRO FUJITA ,  ATSUSHI SAITOU ,  NOBORU NAGASE

IPC: H01L23/495 ,  H01L23/31 ,  B62D5/04

Abstract: A semiconductor module includes: semiconductor elements having a gate electrode, a first electrode and a second electrode; a resin mold; and conductive members connected to at least one of the semiconductor elements and having a common wiring electrode exposed from the resin mold and connected to the first electrode or the second electrode and a non-common wiring electrode exposed from the resin mold and connected to an electrode of the semiconductor element different from the common wiring electrode. A width of a common wiring connected to the common wiring electrode is wider than the non-common wiring electrode. The common wiring is arranged from one side to an opposite side on a surface of the resin mold, on which the common wiring electrode is exposed, without being electrically connected to the non-common wiring electrode.

公开(公告)号：US20220247283A1

公开(公告)日：2022-08-04

申请号：US17660001

申请日：2022-04-20

Applicant: DENSO CORPORATION

Inventor： SYUHEI MIYACHI ,  ATSUSHI SAITOU ,  TOSHIHIRO FUJITA ,  NOBORU NAGASE

IPC: H02K11/33 ,  H05K1/18 ,  H02K9/22

Abstract: An electronic device includes: a wiring board; an electric connection wiring connected to a power supply; motor connection wirings arranged on a peripheral side of the wiring board and connected to the electric motor; and semiconductor modules having semiconductor elements and a resin mold. The semiconductor modules are arranged at a position on the electric connection wiring or on the peripheral side of the electric connection wiring and on a center side of the motor connection wiring. At least a part of electrodes of the plurality of semiconductor modules is mounted on the electric connection wiring.