公开(公告)号：US20220247283A1

公开(公告)日：2022-08-04

申请号：US17660001

申请日：2022-04-20

Applicant: DENSO CORPORATION

Inventor： SYUHEI MIYACHI ,  ATSUSHI SAITOU ,  TOSHIHIRO FUJITA ,  NOBORU NAGASE

IPC: H02K11/33 ,  H05K1/18 ,  H02K9/22

Abstract: An electronic device includes: a wiring board; an electric connection wiring connected to a power supply; motor connection wirings arranged on a peripheral side of the wiring board and connected to the electric motor; and semiconductor modules having semiconductor elements and a resin mold. The semiconductor modules are arranged at a position on the electric connection wiring or on the peripheral side of the electric connection wiring and on a center side of the motor connection wiring. At least a part of electrodes of the plurality of semiconductor modules is mounted on the electric connection wiring.

公开(公告)号：US20240007105A1

公开(公告)日：2024-01-04

申请号：US18467716

申请日：2023-09-14

Applicant: DENSO CORPORATION

Inventor： TOSHIHIRO FUJITA ,  ATSUSHI SAITO ,  NOBORU NAGASE

IPC: H03K17/687 ,  H02K11/33 ,  H02K9/22

CPC classification number: H03K17/6871 ,  H02K11/33 ,  H02K9/227 ,  B62D5/0406

Abstract: A semiconductor module includes a switching element, a sealing portion, a drain terminal, a source terminal, and a gate terminal. The drain terminal is connected to a drain of the switching element. The source terminal is connected to a source of the switching element. The gate terminal is connected to a gate of the switching element. The sealing portion has a rectangular shape in a plan view, and molds the switching element. Each of the drain terminal, the source terminal, and the gate terminal is exposed from the sealing portion on a short side of the rectangle.

公开(公告)号：US20220223501A1

公开(公告)日：2022-07-14

申请号：US17657064

申请日：2022-03-29

Applicant: DENSO CORPORATION

Inventor： SYUHEI MIYACHI ,  TOSHIHIRO FUJITA ,  ATSUSHI SAITOU ,  NOBORU NAGASE

IPC: H01L23/495 ,  H01L23/31 ,  B62D5/04

Abstract: A semiconductor module includes: semiconductor elements having a gate electrode, a first electrode and a second electrode; a resin mold; and conductive members connected to at least one of the semiconductor elements and having a common wiring electrode exposed from the resin mold and connected to the first electrode or the second electrode and a non-common wiring electrode exposed from the resin mold and connected to an electrode of the semiconductor element different from the common wiring electrode. A width of a common wiring connected to the common wiring electrode is wider than the non-common wiring electrode. The common wiring is arranged from one side to an opposite side on a surface of the resin mold, on which the common wiring electrode is exposed, without being electrically connected to the non-common wiring electrode.