公开(公告)号：US20160206835A1

公开(公告)日：2016-07-21

申请号：US15082248

申请日：2016-03-28

Applicant: DELTA ELECTRONICS, INC.

Inventor： Kuo-Liang LEE ,  Chun-Kai CHUANG

IPC: A61M11/00

CPC classification number: A61M11/005 ,  A61M15/0028 ,  A61M15/0085 ,  A61M2205/123 ,  B05B17/06 ,  B05B17/0646

Abstract: A nebulizing device includes a medicament storage module, a nebulizing unit, and a first waterproof gasket. In the medicament storage module, a coupling part is connected with an outer surface of a tubular sidewall and aligned with an outlet of the tubular sidewall, and includes an extension wall and a first recess where the nebulizing unit is disposed. The first waterproof gasket is disposed within the first recess and located on a side of the nebulizing unit farther from the outlet. In the first waterproof gasket, a first opening is disposed adjacent to the nebulizing unit, a second opening is disposed opposite to the first opening and located on a side of the first opening farther from the nebulizing unit, the size of the second opening is greater than that of the first opening, and the annular wall structure is connected to the first opening and the second opening.

Abstract translation: 雾化装置包括药物储存模块，雾化单元和第一防水垫圈。 在药剂储存模块中，联接部分与管状侧壁的外表面连接并与管状侧壁的出口对准，并且包括延伸壁和设置雾化单元的第一凹部。 第一防水垫圈设置在第一凹槽内并且位于雾化单元的离出口更远的一侧。 在第一防水垫圈中，与雾化单元相邻设置第一开口，第二开口与第一开口相对设置，并且位于距离雾化单元更远的第一开口的一侧，第二开口的尺寸更大 并且环形壁结构与第一开口和第二开口连接。

公开(公告)号：US20140251668A1

公开(公告)日：2014-09-11

申请号：US13969940

申请日：2013-08-19

Applicant: DELTA ELECTRONICS, INC.

Inventor： Chun-Kai CHUANG ,  Yu-Wei LEE ,  Kuo-Liang LEE

IPC: H05K3/30 ,  H05K1/18

CPC classification number: H05K3/305 ,  H05K3/3442 ,  H05K2201/2036 ,  Y02P70/613 ,  Y10T29/4913

Abstract: An automatic manufacturing process for providing buffer pads (40) for a PCB (10), includes a) providing the PCB (10); b) providing an automatic dispensing device and an adhesive (30); c) using the automatic dispensing device to dispense the adhesive (30) to a buffer zone (12) on the PCB (10); d) providing a pick-and-place machine and the buffer pads (40); e) using the pick-and-place machine to place the buffer pads (40) on the buffer zone (12) moistened with the adhesive (30); and f) curing the adhesive (30) to attach the buffer pads (40) to the PCB (10). Thus, labor is saved and manufacturing time is reduced.

Abstract translation: 一种用于为PCB（10）提供缓冲垫（40）的自动制造过程，包括：a）提供PCB（10）; b）提供自动分配装置和粘合剂（30）; c）使用自动分配装置将粘合剂（30）分配到PCB（10）上的缓冲区（12）上; d）提供拾取和放置机器和缓冲垫（40）; e）使用拾取和放置机器将缓冲垫（40）放置在用粘合剂（30）润湿的缓冲区（12）上; 以及f）固化粘合剂（30）以将缓冲垫（40）附接到PCB（10）。 因此，节省劳动力并减少制造时间。