公开(公告)号：US20020145181A1

公开(公告)日：2002-10-10

申请号：US09829208

申请日：2001-04-09

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： Ronald D. Myer ,  David J. Post ,  Bradley R. Knigga ,  Paul C. Staab

IPC: H01L023/495

CPC classification number: H01L23/047 ,  H01L21/50 ,  H01L23/24 ,  H01L24/97 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  Y10T83/0605 ,  Y10T83/159 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of fabricating a microelectronic device package is provided. The method includes a continuous processing mode of microelectronic device packages wherein process steps for fabricating the microelectronic device package are performed resulting in savings from the removal of more expensive batch processing steps.