公开(公告)号：US20240110085A1

公开(公告)日：2024-04-04

申请号：US18528894

申请日：2023-12-05

Applicant: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC

Inventor： FELIX KOCH ,  SERGIO GRUNDER ,  ANDREAS LUTZ

IPC: C09J163/00 ,  C08G18/69 ,  C08G18/80 ,  C08K7/04 ,  C08L75/04 ,  C09J11/04 ,  C09J11/06

CPC classification number: C09J163/00 ,  C08G18/698 ,  C08G18/8067 ,  C08K7/04 ,  C08L75/04 ,  C09J11/04 ,  C09J11/06 ,  C08G59/4021

Abstract: One-component toughened epoxy structural adhesives contain fibrous mineral fillers that have an aspect ratio of ≥6. The presence of the fibrous filler leads to a significant increase in elastic modulus while having little if any adverse effect on other properties such as dynamic impact peel resistance.

公开(公告)号：US20210237365A1

公开(公告)日：2021-08-05

申请号：US17049080

申请日：2019-05-16

Applicant: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC

Inventor： ANDREAS LUTZ ,  DANIEL SCHNEIDER ,  IRENE MAEDER ,  MARCEL ASCHWANDEN ,  MICHAEL RAS

IPC: B29C65/48 ,  B29C65/00 ,  B29C65/52 ,  C09J163/00

Abstract: Adhesive bonds are applied by mixing two adhesives with different properties and dispensing them to form bondlines between substrate pairs. The adhesives are then thermally cured and cooled. Varying the mix ratio permits one to vary the properties of the adhesive mixture so formed for use in bonding many different substrate pairs. The process allows potentially infinite variations of adhesive properties between those of the respective starting adhesives, simply by varying the mix ratio. The invention is especially adapted for use in manufacturing settings in which adhesives are to be applied in multiple places, but differing adhesive properties are needed among the various bonding areas.

公开(公告)号：US20240199931A1

公开(公告)日：2024-06-20

申请号：US18555980

申请日：2021-06-16

Applicant: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC ,  ROHM AND HAAS ELECTRONIC MATERIALS (SHANGHAI) LTD.

Inventor： HUIDE D. ZHU ,  MATTHEW FELDPAUSCH ,  WEIGUO SHAO ,  TYLER AUVIL ,  LIRONG ZHOU ,  DANIEL SOPHIEA ,  ANDREAS LUTZ

IPC: C09J175/08 ,  C08G18/12 ,  C08G18/20 ,  C08G18/24 ,  C08G18/40 ,  C08G18/42 ,  C08G18/48 ,  C08G18/72 ,  C08G18/75 ,  C08G18/76 ,  C08K3/22 ,  C08K5/3492 ,  C08K5/5313 ,  C09J9/00

CPC classification number: C09J175/08 ,  C08G18/12 ,  C08G18/2081 ,  C08G18/244 ,  C08G18/4018 ,  C08G18/4238 ,  C08G18/4812 ,  C08G18/4825 ,  C08G18/4829 ,  C08G18/721 ,  C08G18/755 ,  C08G18/7671 ,  C09J9/00 ,  C08K2003/2227 ,  C08K5/34928 ,  C08K5/5313 ,  C08K2201/005

Abstract: Provided herein is a one-component polyurethane adhesive composition showing good mechanical characteristics, non-sag performance, product storage stability, as well as flame-retardancy.

公开(公告)号：US20220228045A1

公开(公告)日：2022-07-21

申请号：US17595400

申请日：2020-06-18

Applicant: DDP Specialty Electronic Materials US, LLC

Inventor： FELIX KOCH ,  STEFAN SCHMATLOCH ,  EDWIN ZUEGER ,  GABRIELE TASSELLI ,  SERGIO GRUNDER ,  FILIPPO ARDIZZONE ,  ANDREAS LUTZ

IPC: C09J175/08 ,  C09J175/06 ,  C08G18/30 ,  C08G18/12 ,  C08G18/32 ,  C08G18/73 ,  C08G18/76 ,  C08G18/79 ,  C08G18/48 ,  C08G18/50

Abstract: Disclosed is an adhesive system and method of use thereof wherein the adhesive composition comprises a moisture curable adhesive comprised of an isocyanate terminated prepolymer and a cure accelerator having two curatives components having different cure kinetics. The cure accelerator is comprised of an isocyanate reactive compound comprising a primary, secondary or tertiary amino group, or a primary thiol group having faster curing kinetics resulting an increase in bead stability within the first minutes and a polyol selected from a diol and/or triol with slower curing kinetics allowing for sufficient open time and yet a fast strength build up. The preferred method of application of the adhesive system is via a 1K application gun.

公开(公告)号：US20240271023A1

公开(公告)日：2024-08-15

申请号：US18569339

申请日：2022-06-03

Applicant: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC

Inventor： ANDREAS LUTZ ,  DANIEL SCHNEIDER

IPC: C09J175/08 ,  C08G18/10 ,  C08G18/16 ,  C08G18/18 ,  C08G18/22 ,  C08G18/34 ,  C08G18/48 ,  C08G18/66 ,  C08G18/73 ,  C09J11/04

CPC classification number: C09J175/08 ,  C08G18/10 ,  C08G18/163 ,  C08G18/1833 ,  C08G18/227 ,  C08G18/34 ,  C08G18/4825 ,  C08G18/6692 ,  C08G18/73 ,  C09J11/04

Abstract: Provided herein is a two-component polyurethane adhesive composition.

公开(公告)号：US20230323174A1

公开(公告)日：2023-10-12

申请号：US18025545

申请日：2021-09-09

Applicant: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC . ,  DDP SPECIALTY PRODUCTS JAPAN K.K.

Inventor： SERGIO GRUNDER ,  MARCEL ASCHWANDEN ,  TOMONORI TAKAHASHI ,  ANDREAS LUTZ

IPC: C09J175/14 ,  C09K5/14 ,  C09J5/00 ,  C09J11/04 ,  C08G18/10 ,  C08G18/76 ,  C08G18/48 ,  H01M10/653 ,  H01M10/613

CPC classification number: C09J175/14 ,  C09K5/14 ,  C09J5/00 ,  C09J11/04 ,  C08G18/10 ,  C09J2301/408 ,  C08G18/4825 ,  H01M10/653 ,  H01M10/613 ,  C09J2475/00 ,  C08G18/7614

Abstract: Provided herein is a two-component thermal interface material.

公开(公告)号：US20220195267A1

公开(公告)日：2022-06-23

申请号：US17595410

申请日：2020-05-28

Applicant: DDP Specialty Electronic Materials US, LLC

Inventor： ANDREAS LUTZ ,  DANIEL SCHNEIDER ,  JEANNINE FLUECKIGER ,  FELIX KOCH

IPC: C09J163/00 ,  C08G18/48 ,  C08G18/73 ,  C08G18/69 ,  C08L63/00

Abstract: The present invention is a toughened one component epoxy adhesive composition demonstrating improved resistance to humidity. Wherein said one-part structural adhesive comprises: A) a blocked PU-polymer toughener compound; B) an epoxy resin component comprising a solid epoxy resin, a liquid epoxy resin, or mixture thereof; C) a curing agent; D) a urea compound; and E) optionally a filler, wherein the blocked PU-polymer toughener (A) is a reaction product of a reaction mixture comprising of: i) a polyether, ii) a hydroxyl-terminated polybutadiene, iii) a polyisocyanate, iv) a chain extender, and v) a capping group.