公开(公告)号：US12193438B2

公开(公告)日：2025-01-14

申请号：US15577125

申请日：2016-05-25

Applicant: Dümmen Group B.V.

Inventor： Pankaj Bacharam Dhonukshe ,  Tobias Günter Dummen ,  Johannes Franciscus Johanna Maria van den Heuvel

IPC: A01N25/10 ,  A01G2/10 ,  A01G2/30 ,  A01G2/35 ,  A01N3/00 ,  A01N25/00 ,  A01N25/02 ,  A01N25/24 ,  A01N47/40

Abstract: Provided herein are methods for providing improved vigor, and especially priming or improving root formation, of plant cuttings and to plant cuttings obtained thereby. Specifically, the methods include the steps of a) contacting a plant cutting with a polymeric solution, or suspension, optionally including one or more plant growth promoting and/or plant protecting compounds, thereby providing a coated plant cutting; b) allowing the polymeric solution, or suspension, of the coated plant cutting to solidify into a complexed coating, thereby providing an encapsulated plant cutting. The encapsulated plant cutting is coated with the complexed coating from the basal cut surface or tip of the plant cutting to less than 60% of the total length of said plant cutting to partially encapsulate the plant cutting with the complexed coating.

公开(公告)号：US20190021312A1

公开(公告)日：2019-01-24

申请号：US15577125

申请日：2016-05-25

Applicant: Dümmen Group B.V.

Inventor： Pankaj Bacharam Dhonukshe ,  Tobias Günter Dümmen ,  Johannes Franciscus Johanna Maria Van Den Heuvel

IPC: A01N25/10 ,  A01N25/02 ,  A01N3/00 ,  A01G2/35 ,  A01N47/40

Abstract: Provided herein are methods for providing improved vigor, and especially priming or improving root formation, of plant cuttings and to plant cuttings obtained thereby. Specifically, the methods include the steps of a) contacting a plant cutting with a polymeric solution, or suspension, optionally including one or more plant growth promoting and/or plant protecting compounds, thereby providing a coated plant cutting; b) allowing the polymeric solution, or suspension, of the coated plant cutting to solidify into a complexed coating, thereby providing an encapsulated plant cutting. The encapsulated plant cutting is coated with the complexed coating from the basal cut surface or tip of the plant cutting to less than 60% of the total length of said plant cutting to partially encapsulate the plant cutting with the complexed coating.