公开(公告)号：US06865790B2

公开(公告)日：2005-03-15

申请号：US10083794

申请日：2002-02-27

Applicant: Craig A. Young ,  Duane S. Stackhouse

Inventor： Craig A. Young ,  Duane S. Stackhouse

IPC: G02B6/42 ,  H01S5/02 ,  H01S5/022 ,  H01S5/068 ,  B23P19/02

CPC classification number: H01S5/06804 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4214 ,  G02B6/4246 ,  H01L2224/48091 ,  H01S5/02252 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/02284 ,  H01S5/02492 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49815 ,  Y10T29/49821 ,  Y10T29/49822 ,  Y10T29/53274 ,  Y10T29/53283 ,  Y10T156/1189 ,  H01L2924/00014

Abstract: A method of removing an optical device contained within a device package from a circuit board, wherein the device package is secured to the circuit board using an adhesive pad. The method includes peeling a portion of the adhesive pad away from the circuit board, inserting an optical removal tool between the optical device and the circuit board, wherein the optical removal tool has a pair of fork portions and a cavity positioned between the fork portions, and the fork portions straddle one or more leads on the optical device during the inserting step, and prying the remainder of the adhesive pad away from the circuit board using the optical device removal tool.

Abstract translation: 一种从电路板去除包含在器件封装内的光学器件的方法，其中器件封装使用粘合垫固定到电路板。 该方法包括将粘合垫的一部分远离电路板剥离，在光学装置和电路板之间插入光学去除工具，其中光学去除工具具有一对叉部和位于叉部之间的空腔， 并且在插入步骤期间叉部跨越光学装置上的一个或多个引线，并且使用光学装置移除工具将粘合垫的其余部分从电路板上远离。

公开(公告)号：US06870735B2

公开(公告)日：2005-03-22

申请号：US10396908

申请日：2003-03-25

Applicant: Ronald R. Genova ,  Duane S. Stackhouse

Inventor： Ronald R. Genova ,  Duane S. Stackhouse

IPC: H01L23/36 ,  H01L23/367 ,  H05H7/20

CPC classification number: H01L23/367 ,  H01L23/3677 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat sink is for an element to be cooled has a thermally conductive base and a plurality of thermally conductive pins or fins extending substantially perpendicular from the base, said pins or fins being arranged in a predetermined pattern. The pins at least partially frame thermally conductive projections extending substantially perpendicular from said base which forming a discernable logo having an upper surface and sides for providing plural cooling surfaces. In this instance the 3-D logo performs cooling of the components within a package.

Abstract translation: 用于要冷却的元件的散热器具有导热基座和从基座基本上垂直延伸的多个导热销或翅片，所述销或翅片以预定图案布置。 所述销至少部分地框架从所述底座基本上垂直延伸的导热突起，其形成具有上表面的可辨别的标识和用于提供多个冷却表面的侧面。 在这种情况下，3-D标识执行封装内部组件的冷却。

公开(公告)号：US06517258B1

公开(公告)日：2003-02-11

申请号：US09344657

申请日：1999-06-25

Applicant: Joseph P. Keska ,  Steven L. Moyer ,  Mary J. Nadeau ,  Steven P. O'Neill ,  John William Osenbach ,  Duane S. Stackhouse ,  Katherine Anne Yanushefski

Inventor： Joseph P. Keska ,  Steven L. Moyer ,  Mary J. Nadeau ,  Steven P. O'Neill ,  John William Osenbach ,  Duane S. Stackhouse ,  Katherine Anne Yanushefski

IPC: G02B636

CPC classification number: G02B6/4292 ,  G02B6/4204 ,  G02B6/4245 ,  G02B6/4274 ,  G02B6/4277 ,  G02B6/4281 ,  G02B6/4283 ,  H05K1/189

Abstract: The invention is an optoelectronic device including a semiconductor photodetector enclosed within a plastic housing. The housing includes a wall with an aperture therein for receiving optical signals. The photodetector is mounted to a flexible film which is, in turn, mounted to the housing so that the photodetector is aligned with the aperture. The device may further include a receptacle mounted to the wall for receiving an optical fiber aligned with the aperture and the photodetector.

Abstract translation: 本发明是一种光电器件，其包括封装在塑料外壳内的半导体光电探测器。 壳体包括其中具有用于接收光信号的孔的壁。 光电检测器被安装到柔性膜上，柔性膜再依次安装到外壳上，使得光电检测器与孔对准。 该装置还可以包括安装到壁的插座，用于接收与孔和光电检测器对准的光纤。