公开(公告)号：US09763317B2

公开(公告)日：2017-09-12

申请号：US13803828

申请日：2013-03-14

Applicant: Cisco Technology, Inc.

Inventor： James A. Mass ,  David Lynn Artman ,  Timothy A. Frank

IPC: B23K31/02 ,  H05K1/02 ,  B23K1/00 ,  B23K101/36 ,  H05K3/00

CPC classification number: H05K1/0204 ,  B23K1/0016 ,  B23K2101/36 ,  H05K1/0243 ,  H05K3/0061 ,  H05K2201/0959 ,  H05K2201/10416 ,  Y10T29/49128 ,  Y10T29/49165

Abstract: In one embodiment, a printed circuit board (PCB) assembly includes a PCB, the PCB being arranged to define a through-hole therein, the through-hole having a surface, wherein the PCB includes a top surface and a bottom surface. The PCB assembly also includes a slug arrangement and a surface mount component. The slug arrangement is formed from an electrically and thermally conductive material and includes at least a first portion and a second portion. At least a part of the first portion is positioned in the through-hole, and the second portion is coupled to the bottom surface. The surface mount component is positioned over the through-hole and the top surface, and has a first surface configured to contact the first portion.

公开(公告)号：US20140268580A1

公开(公告)日：2014-09-18

申请号：US13803828

申请日：2013-03-14

Applicant: CISCO TECHNOLOGY, INC.

Inventor： James A. Mass ,  David Lynn Artman ,  Timothy A. Frank

IPC: H05K1/02 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K1/0204 ,  B23K1/0016 ,  B23K2101/36 ,  H05K1/0243 ,  H05K3/0061 ,  H05K2201/0959 ,  H05K2201/10416 ,  Y10T29/49128 ,  Y10T29/49165

Abstract: In one embodiment, a printed circuit board (PCB) assembly includes a PCB, the PCB being arranged to define a through-hole therein, the through-hole having a surface, wherein the PCB includes a top surface and a bottom surface. The PCB assembly also includes a slug arrangement and a surface mount component. The slug arrangement is formed from an electrically and thermally conductive material and includes at least a first portion and a second portion. At least a part of the first portion is positioned in the through-hole, and the second portion is coupled to the bottom surface. The surface mount component is positioned over the through-hole and the top surface, and has a first surface configured to contact the first portion.

Abstract translation: 在一个实施例中，印刷电路板（PCB）组件包括PCB，PCB布置成在其中限定通孔，通孔具有表面，其中PCB包括顶表面和底表面。 PCB组件还包括块状排列和表面安装部件。 芯块布置由导电和导热材料形成并且包括至少第一部分和第二部分。 第一部分的至少一部分位于通孔中，并且第二部分联接到底表面。 表面安装部件定位在通孔和顶表面上方，并且具有被配置为接触第一部分的第一表面。