Microelectromechanical system device and method for preparing the same for subsequent processing
    1.
    发明申请
    Microelectromechanical system device and method for preparing the same for subsequent processing 失效
    微机电系统装置及其制备方法,用于后续处理

    公开(公告)号:US20080108163A1

    公开(公告)日:2008-05-08

    申请号:US11541993

    申请日:2006-10-02

    IPC分类号: H01L21/00

    摘要: A method for preparing a microelectomechanical system (MEMS) device for subsequent processing is disclosed. The method includes establishing an anti-stiction material on exposed surfaces of the MEMS device. The exposed surfaces include at least an interior surface of a chamber and an external surface of the MEMS device. The anti-stiction material is selectively removed from at least a portion of the external surface via a plasma sputtering process under controlled conditions.

    摘要翻译: 公开了一种用于制备用于后续处理的微机电系统(MEMS)装置的方法。 该方法包括在MEMS器件的暴露表面上建立抗静电材料。 暴露的表面包括至少室的内表面和MEMS装置的外表面。 在受控条件下,通过等离子体溅射工艺,从外表面的至少一部分选择性地除去抗静电材料。