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公开(公告)号：US20090219107A1
公开(公告)日：2009-09-03
申请号：US12039529
申请日：2008-02-28
申请人： Charles Woods , Noel Lopez
发明人： Charles Woods , Noel Lopez
CPC分类号： H01P5/107
摘要： In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. The interface comprises an isolation wall placed between an input and output region of an integrated circuit to reduce ripple and isolate the waveguide cavity from the monolithic microwave integrated circuit circuitry. The interface further comprises a turning screw or other similar member that is configured to closely match the impedance of integrated circuit 11 with the impedance at interface 10 to further reduce loss.
摘要翻译： 通常，根据本发明的示例性方面，公开了用于将诸如单片微波集成电路的集成电路连接到诸如波导的能量传输装置的低损耗接口。 该接口包括放置在集成电路的输入和输出区域之间的隔离壁，以减少纹波并将波导腔与单片微波集成电路电路隔离。 该接口还包括旋转螺钉或其他相似的构件，其构造成将集成电路11的阻抗与界面10处的阻抗紧密匹配，以进一步减少损耗。
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公开(公告)号：US20090231055A1
公开(公告)日：2009-09-17
申请号：US12403292
申请日：2009-03-12
申请人： Noel Lopez , Charles Woods , Rob Zienkewicz , Jon Filreis
发明人： Noel Lopez , Charles Woods , Rob Zienkewicz , Jon Filreis
IPC分类号： H01P5/00
摘要： In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.
摘要翻译： 通常，根据本发明的示例性方面，提供了一种配置为使用诸如来自单片微波集成电路或MMIC的微波信号的组合的功率的电气系统。 在一个示例性实施例中，本发明的系统还包括电路直接连接到的低损耗接口。 在另一个示例性实施例中，电路连接到连接到低损耗接口的引脚。 在本发明的另一个示例性实施例中，提供了一种多层功率放大器，其包括两个或多个根据本发明的阻抗匹配接口的底板和电路。 该多层功率放大器被配置为放大能量信号并且与现有功率组合器相比具有显着减小的体积。
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公开(公告)号：US20120229219A1
公开(公告)日：2012-09-13
申请号：US13472231
申请日：2012-05-15
申请人： Noel Lopez , Charles Woods , Rob Zienkewicz , Jon Filreis
发明人： Noel Lopez , Charles Woods , Rob Zienkewicz , Jon Filreis
IPC分类号： H03F3/14
摘要： In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.
摘要翻译： 通常，根据本发明的示例性方面，提供了一种配置为使用诸如来自单片微波集成电路或MMIC的微波信号的组合的功率的电气系统。 在一个示例性实施例中，本发明的系统还包括电路直接连接到的低损耗接口。 在另一个示例性实施例中，电路连接到连接到低损耗接口的引脚。 在本发明的另一个示例性实施例中，提供了一种多层功率放大器，其包括两个或多个根据本发明的阻抗匹配接口的底板和电路。 该多层功率放大器被配置为放大能量信号并且与现有功率组合器相比具有显着减小的体积。
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公开(公告)号：US08212631B2
公开(公告)日：2012-07-03
申请号：US12403292
申请日：2009-03-12
申请人： Noel Lopez , Charles Woods , Rob Zienkewicz , Jon Filreis
发明人： Noel Lopez , Charles Woods , Rob Zienkewicz , Jon Filreis
IPC分类号： H01P5/12
摘要： In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.
摘要翻译： 通常，根据本发明的示例性方面，提供了一种配置为使用诸如来自单片微波集成电路或MMIC的微波信号的组合的功率的电气系统。 在一个示例性实施例中，本发明的系统还包括电路直接连接到的低损耗接口。 在另一个示例性实施例中，电路连接到连接到低损耗接口的引脚。 在本发明的另一个示例性实施例中，提供了一种多层功率放大器，其包括两个或多个根据本发明的阻抗匹配接口的底板和电路。 该多层功率放大器被配置为放大能量信号并且与现有功率组合器相比具有显着减小的体积。
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公开(公告)号：US20060202783A1
公开(公告)日：2006-09-14
申请号：US10906900
申请日：2005-03-11
申请人： Noel Lopez , Charles Woods
发明人： Noel Lopez , Charles Woods
IPC分类号： H01P1/20
CPC分类号： H01P1/20372
摘要： An apparatus comprises a radio frequency filter and a dielectric material configured to alter the frequency response of the RF filter, wherein said dielectric material is located in proximity to said RF filter. The apparatus may be useful in a satellite antenna system wherein the RF filter is configured to have an initial frequency response. The dielectric material may be configured to shift the frequency response of the RF filter from the initial frequency response to a shifted frequency response. The dielectric material may be a polyimide tape. A method is also provided for reworking a non-compliant PWB, wherein the PWB is non-compliant with a standard frequency response to a given RF input signal, and wherein the PWB comprises an RF filter. The method comprises the step of adjusting the frequency response of the RF filter by adding a piece of polyimide tape in proximity to the RF filter.
摘要翻译： 一种装置包括射频滤波器和配置成改变RF滤波器的频率响应的电介质材料，其中所述介电材料位于所述RF滤波器附近。 该装置在卫星天线系统中可能是有用的，其中RF滤波器被配置为具有初始频率响应。 介电材料可以被配置为将RF滤波器的频率响应从初始频率响应移位到移动的频率响应。 电介质材料可以是聚酰亚胺胶带。 还提供了一种用于重新编写不兼容的PWB的方法，其中PWB不符合给定RF输入信号的标准频率响应，并且其中PWB包括RF滤波器。 该方法包括通过在RF滤波器附近添加一块聚酰亚胺带来调节RF滤波器的频率响应的步骤。
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公开(公告)号：US20090066441A1
公开(公告)日：2009-03-12
申请号：US11853287
申请日：2007-09-11
申请人： Charles Woods , Noel Lopez , Dean Cook , Jon Filreis
发明人： Charles Woods , Noel Lopez , Dean Cook , Jon Filreis
IPC分类号： H03H7/38
CPC分类号： H01P5/107 , H01L23/66 , H01L2223/6633 , H01L2224/48091 , H01L2924/19039 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a pin attached to a matching network that matches the impedance of the energy produced at the circuit to the impedance required by the waveguide without the use of a dielectric material.
摘要翻译： 通常，根据本发明的示例性方面，公开了用于将诸如单片微波集成电路的集成电路连接到诸如波导的能量传输装置的低损耗接口。 在一个示例性实施例中，接口包括连接到匹配网络的引脚，其将电路产生的能量的阻抗与波导所需的阻抗匹配，而不使用电介质材料。
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公开(公告)号：US08598966B2
公开(公告)日：2013-12-03
申请号：US13472231
申请日：2012-05-15
申请人： Noel Lopez , Charles Woods , Rob Zienkewicz , Jon Filreis
发明人： Noel Lopez , Charles Woods , Rob Zienkewicz , Jon Filreis
IPC分类号： H01P5/12
摘要： In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.
摘要翻译： 通常，根据本发明的示例性方面，提供了一种配置为使用诸如来自单片微波集成电路或MMIC的微波信号的组合的功率的电气系统。 在一个示例性实施例中，本发明的系统还包括电路直接连接到的低损耗接口。 在另一个示例性实施例中，电路连接到连接到低损耗接口的引脚。 在本发明的另一个示例性实施例中，提供了一种多层功率放大器，其包括两个或多个根据本发明的阻抗匹配接口的底板和电路。 该多层功率放大器被配置为放大能量信号并且与现有功率组合器相比具有显着减小的体积。
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公开(公告)号：US07812686B2
公开(公告)日：2010-10-12
申请号：US12039529
申请日：2008-02-28
申请人： Charles Woods , Noel Lopez
发明人： Charles Woods , Noel Lopez
IPC分类号： H01P5/107
CPC分类号： H01P5/107
摘要： In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. The interface comprises an isolation wall placed between an input and output region of an integrated circuit to reduce ripple and isolate the waveguide cavity from the monolithic microwave integrated circuit circuitry. The interface further comprises a turning screw or other similar member that is configured to closely match the impedance of integrated circuit 11 with the impedance at interface 10 to further reduce loss.
摘要翻译： 通常，根据本发明的示例性方面，公开了用于将诸如单片微波集成电路的集成电路连接到诸如波导的能量传输装置的低损耗接口。 该接口包括放置在集成电路的输入和输出区域之间的隔离壁，以减少纹波并将波导腔与单片微波集成电路电路隔离。 该接口还包括旋转螺钉或其他相似的构件，其构造成将集成电路11的阻抗与界面10处的阻抗紧密匹配，以进一步减少损耗。
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公开(公告)号：US07782156B2
公开(公告)日：2010-08-24
申请号：US11853287
申请日：2007-09-11
申请人： Charles Woods , Noel Lopez , Dean Cook , Jon Filreis
发明人： Charles Woods , Noel Lopez , Dean Cook , Jon Filreis
CPC分类号： H01P5/107 , H01L23/66 , H01L2223/6633 , H01L2224/48091 , H01L2924/19039 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a pin attached to a matching network that matches the impedance of the energy produced at the circuit to the impedance required by the waveguide without the use of a dielectric material.
摘要翻译： 通常，根据本发明的示例性方面，公开了用于将诸如单片微波集成电路的集成电路连接到诸如波导的能量传输装置的低损耗接口。 在一个示例性实施例中，接口包括连接到匹配网络的引脚，其将电路产生的能量的阻抗与波导所需的阻抗匹配，而不使用电介质材料。
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公开(公告)号：US20120051000A1
公开(公告)日：2012-03-01
申请号：US13221693
申请日：2011-08-30
申请人： David R. Laidig , Kenneth V. Buer , Michael R. Lyons , Noel Lopez
发明人： David R. Laidig , Kenneth V. Buer , Michael R. Lyons , Noel Lopez
CPC分类号： H05K7/20409 , H01L23/047 , H01L23/315 , H01L23/495 , H01L23/49541 , H01L23/49568 , H01L23/66 , H01L2223/6627 , H01L2223/6683 , H01L2224/48091 , H01Q23/00 , H05K7/02 , H01L2924/00014
摘要： A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.
摘要翻译： 公开了一种MMIC封装，包括：基于引线框的包覆成型封装，位于所述包覆成型封装内的管芯; 和部分波导接口，其中部分波导接口与包覆成型的封装集成，促进了低成本和可靠的组装。 还公开了一种包覆成型的封装，其中管芯位于暴露在封装底部的金属部分上，并且封装构造成用于附接到收发器的底架，使得来自模具的热量容易地以直接热量散发到底架 路径。 本公开有助于MMIC封装的并行组装以及使用拾取和放置/表面安装技术将MMIC封装连接到收发器的底盘。 这有助于可靠和低成本的收发器。
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