公开(公告)号：US20120126399A1

公开(公告)日：2012-05-24

申请号：US13197163

申请日：2011-08-03

Applicant: Charles W. C. LIN ,  Chia-Chung WANG

Inventor： Charles W. C. LIN ,  Chia-Chung WANG

IPC: H01L23/498

CPC classification number: H01L23/3121 ,  H01L21/56 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/1132 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/19 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2224/24101 ,  H01L2224/24221 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/92244 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/0207 ,  H05K1/186 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A semiconductor assembly includes a semiconductor device, a heat spreader, an adhesive and a build-up circuitry. The heat spreader includes a bump, a base and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the build-up circuitry and thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The build-up circuitry includes a dielectric layer and conductive traces on the semiconductor device and the flange. The conductive traces provide signal routing for the semiconductor device.

Abstract translation: 半导体组件包括半导体器件，散热器，粘合剂和积聚电路。 散热器包括凸块，底座和凸缘。 凸块限定一个空腔。 半导体器件安装在空腔处的凸块上，电连接到积聚电路并热连接到凸块。 凸起从基部延伸到粘合剂中的开口中，基部从与腔相对的凸起垂直延伸，并且凸缘从腔入口处的凸起横向延伸。 积聚电路包括介电层和半导体器件上的导电迹线和凸缘。 导电迹线为半导体器件提供信号路由。

公开(公告)号：US20120129299A1

公开(公告)日：2012-05-24

申请号：US13299472

申请日：2011-11-18

Applicant: Charles W.C. LIN ,  Chia-Chung WANG

Inventor： Charles W.C. LIN ,  Chia-Chung WANG

IPC: H01L21/60

CPC classification number: H01L24/19 ,  H01L21/4878 ,  H01L23/13 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15321 ,  H01L2924/15323 ,  H01L2924/181 ,  H01L2924/00

Abstract: A method of making a semiconductor assembly that includes a semiconductor device, a heat spreader, an adhesive and a build-up circuitry is disclosed. The heat spreader includes a bump, a base and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the build-up circuitry and thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The build-up circuitry includes a dielectric layer and conductive traces on the semiconductor device and the flange. The conductive traces provide signal routing for the semiconductor device.

Abstract translation: 公开了制造包括半导体器件，散热器，粘合剂和积聚电路的半导体组件的方法。 散热器包括凸块，底座和凸缘。 凸块限定一个空腔。 半导体器件安装在空腔处的凸块上，电连接到积聚电路并热连接到凸块。 凸起从基部延伸到粘合剂中的开口中，基部从与腔相对的凸起垂直延伸，并且凸缘从腔入口处的凸起横向延伸。 积聚电路包括介电层和半导体器件上的导电迹线和凸缘。 导电迹线为半导体器件提供信号路由。