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公开(公告)号：US20120024584A1
公开(公告)日：2012-02-02
申请号：US12844109
申请日：2010-07-27
申请人： Chang-Ming Lee , Wen-Fang Liu , Shih-Jung Huang , Ling-Kai Su
发明人： Chang-Ming Lee , Wen-Fang Liu , Shih-Jung Huang , Ling-Kai Su
CPC分类号： H05K3/4092 , H05K3/4007 , H05K2201/0311 , Y10T29/49204
摘要： A method of manufacturing a connector is provided. Firstly, a substrate having a first surface, a second surface opposite to the first surface and a through hole is provided. Next, a first conductive layer covering the inside wall of the through hole is formed on the substrate. Then, a filler is filled in the through hole to form a filler post. Next, a conductive elastic cantilever is formed over the first surface and electrically connected to the first conductive layer. Then, a gold layer is formed on the conductive elastic cantilever and over the first surface. A solder ball electrically connected to the first conductive layer is formed over the second surface.
摘要翻译： 提供一种制造连接器的方法。 首先，提供具有第一表面，与第一表面相对的第二表面和通孔的基板。 接着，在基板上形成覆盖贯通孔的内壁的第一导电层。 然后，在通孔中填充填料以形成填料柱。 接下来，在第一表面上形成导电弹性悬臂，并电连接到第一导电层。 然后，在导电弹性悬臂上形成金层，并在第一表面上形成金层。 电连接到第一导电层的焊球形成在第二表面上。
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公开(公告)号：US20120015304A1
公开(公告)日：2012-01-19
申请号：US12837462
申请日：2010-07-15
申请人： Chang-Ming Lee , Wen-Fang Liu , Shih-Jung Huang , Ling-Kai Su
发明人： Chang-Ming Lee , Wen-Fang Liu , Shih-Jung Huang , Ling-Kai Su
CPC分类号： H01L23/49811 , H01L21/4853 , H01L21/486 , H01L23/49827 , H01L2924/0002 , H01L2924/00
摘要： Method for fabricating an interposer is provided. A substrate is provided having thereon at least a conductive via and at least a flange. The flange is bonded on the substrate and shades a portion of the via. A photoresist layer is formed on the interior surface of the via, on a contact surface of the flange and on an inner surface of the flange opposite to the contact surface. An opening is formed in the photoresist layer to expose a portion of the contact surface of the flange, while the photoresist layer still covers the interior surface of the via and the inner surface of the flange. A plating layer is formed on the exposed contact surface of the flange. The photoresist layer is then removed.
摘要翻译： 提供了一种制造插入件的方法。 设置有至少具有导电通孔和至少凸缘的衬底。 法兰结合在基板上并遮蔽通孔的一部分。 在通孔的内表面上，在凸缘的接触表面和与接触表面相对的凸缘的内表面上形成光致抗蚀剂层。 在光致抗蚀剂层中形成开口以暴露凸缘的接触表面的一部分，而光致抗蚀剂层仍然覆盖通孔的内表面和凸缘的内表面。 在凸缘的暴露的接触表面上形成镀层。 然后除去光致抗蚀剂层。
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公开(公告)号：US08294042B2
公开(公告)日：2012-10-23
申请号：US12844109
申请日：2010-07-27
申请人： Chang-Ming Lee , Wen-Fang Liu , Shih-Jung Huang , Ling-Kai Su
发明人： Chang-Ming Lee , Wen-Fang Liu , Shih-Jung Huang , Ling-Kai Su
CPC分类号： H05K3/4092 , H05K3/4007 , H05K2201/0311 , Y10T29/49204
摘要： A method of manufacturing a connector is provided. Firstly, a substrate having a first surface, a second surface opposite to the first surface and a through hole is provided. Next, a first conductive layer covering the inside wall of the through hole is formed on the substrate. Then, a filler is filled in the through hole to form a filler post. Next, a conductive elastic cantilever is formed over the first surface and electrically connected to the first conductive layer. Then, a gold layer is formed on the conductive elastic cantilever and over the first surface. A solder ball electrically connected to the first conductive layer is formed over the second surface.
摘要翻译： 提供一种制造连接器的方法。 首先，提供具有第一表面，与第一表面相对的第二表面和通孔的基板。 接着，在基板上形成覆盖贯通孔的内壁的第一导电层。 然后，在通孔中填充填料以形成填料柱。 接下来，在第一表面上形成导电弹性悬臂，并电连接到第一导电层。 然后，在导电弹性悬臂上形成金层，并在第一表面上形成金层。 电连接到第一导电层的焊球形成在第二表面上。
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公开(公告)号：US08318411B2
公开(公告)日：2012-11-27
申请号：US12837462
申请日：2010-07-15
申请人： Chang-Ming Lee , Wen-Fang Liu , Shih-Jung Huang , Ling-Kai Su
发明人： Chang-Ming Lee , Wen-Fang Liu , Shih-Jung Huang , Ling-Kai Su
IPC分类号： G03F7/26
CPC分类号： H01L23/49811 , H01L21/4853 , H01L21/486 , H01L23/49827 , H01L2924/0002 , H01L2924/00
摘要： Method for fabricating an interposer is provided. A substrate is provided having thereon at least a conductive via and at least a flange. The flange is bonded on the substrate and shades a portion of the via. A photoresist layer is formed on the interior surface of the via, on a contact surface of the flange and on an inner surface of the flange opposite to the contact surface. An opening is formed in the photoresist layer to expose a portion of the contact surface of the flange, while the photoresist layer still covers the interior surface of the via and the inner surface of the flange. A plating layer is formed on the exposed contact surface of the flange. The photoresist layer is then removed.
摘要翻译： 提供了一种制造插入件的方法。 设置有至少具有导电通孔和至少凸缘的衬底。 法兰结合在基板上并遮蔽通孔的一部分。 在通孔的内表面上，在凸缘的接触表面和与接触表面相对的凸缘的内表面上形成光致抗蚀剂层。 在光致抗蚀剂层中形成开口以暴露凸缘的接触表面的一部分，而光致抗蚀剂层仍然覆盖通孔的内表面和凸缘的内表面。 在凸缘的暴露的接触表面上形成镀层。 然后除去光致抗蚀剂层。
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公开(公告)号：US20120026708A1
公开(公告)日：2012-02-02
申请号：US12845717
申请日：2010-07-28
申请人： Shih-Jung Huang , Wen-Fang Liu , Ling-Kai Su
发明人： Shih-Jung Huang , Wen-Fang Liu , Ling-Kai Su
CPC分类号： H05K3/4015 , H05K1/141 , H05K3/3436 , H05K3/368 , H05K3/4007 , H05K2201/0311 , H05K2201/10378
摘要： A carrier substrate includes a substrate having a chip side and a PCB side, a plurality of bond pads disposed on the chip side for bonding a chip, a plurality of land grid array (LGA) pads disposed on the PCB side, and a plurality of resilient flanges installed on the PCB side in an array manner. The plurality of resilient flanges electrically connects with the LGA pads correspondingly.
摘要翻译： 载体基板包括具有芯片侧和PCB侧的基板，设置在芯片侧的用于接合芯片的多个接合焊盘，设置在PCB侧的多个焊盘格栅阵列（LGA）焊盘，以及多个 弹性凸缘以阵列方式安装在PCB侧。 多个弹性凸缘相应地与LGA垫电连接。
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公开(公告)号：US08274798B2
公开(公告)日：2012-09-25
申请号：US12845717
申请日：2010-07-28
申请人： Shih-Jung Huang , Wen-Fang Liu , Ling-Kai Su
发明人： Shih-Jung Huang , Wen-Fang Liu , Ling-Kai Su
IPC分类号： H01R9/00
CPC分类号： H05K3/4015 , H05K1/141 , H05K3/3436 , H05K3/368 , H05K3/4007 , H05K2201/0311 , H05K2201/10378
摘要： A carrier substrate includes a substrate having a chip side and a PCB side, a plurality of bond pads disposed on the chip side for bonding a chip, a plurality of land grid array (LGA) pads disposed on the PCB side, and a plurality of resilient flanges installed on the PCB side in an array manner. The plurality of resilient flanges electrically connects with the LGA pads correspondingly.
摘要翻译： 载体基板包括具有芯片侧和PCB侧的基板，设置在芯片侧的用于接合芯片的多个接合焊盘，设置在PCB侧的多个焊盘格栅阵列（LGA）焊盘，以及多个 弹性凸缘以阵列方式安装在PCB侧。 多个弹性凸缘相应地与LGA垫电连接。
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公开(公告)号：US20130029500A1
公开(公告)日：2013-01-31
申请号：US13450485
申请日：2012-04-19
申请人： Chih-Peng Fan , Ling-Kai Su , Yen-Ti Chia
发明人： Chih-Peng Fan , Ling-Kai Su , Yen-Ti Chia
CPC分类号： H01R13/24 , H01R4/04 , H01R43/16 , H01R43/20 , Y10T29/49224
摘要： The present invention provides a connector including a substrate, at least a conductive via disposed inside the substrate, a pad disposed on one surface of the substrate and electrically connected to the conductive via, a resilient flange disposed on the pad, and an anisotropic conductive adhesive interposed between the pad and the resilient flange to electrically connect the pad with the resilient flange.
摘要翻译： 本发明提供了一种连接器，其包括基板，至少设置在基板内部的导电通孔，设置在基板的一个表面上并电连接到导电通孔的焊盘，设置在焊盘上的弹性凸缘和各向异性导电粘合剂 插入垫和弹性凸缘之间以将垫与弹性凸缘电连接。
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