公开(公告)号：US20230187167A1

公开(公告)日：2023-06-15

申请号：US18082543

申请日：2022-12-15

Applicant: Carnegie Mellon University

Inventor： Maarten de Boer ,  Longchang Ni

IPC: H01J37/20 ,  B81B7/00

CPC classification number: H01J37/20 ,  B81B7/0003 ,  H01J2237/20264 ,  H01J2237/20271 ,  H01J2237/20221 ,  H01J2237/3151

Abstract: A micro-electromechanical system (MEMS) device includes a silicon substrate; and a Tantalum (Ta) layer comprising a first portion and a second portion, a first portion being suspended over the silicon substrate and configured to move relative to the silicon substrate, and the second portion of the structure being coupled to the silicon substrate and fixed in place relative to the silicon substrate.