公开(公告)号：US10522963B2

公开(公告)日：2019-12-31

申请号：US15689456

申请日：2017-08-29

Applicant: Corning Incorporated

Inventor： Lovell Eglin Comstock, II ,  Jaques Gollier ,  Thien An Thi Nguyen ,  Garrett Andrew Piech ,  Mark Ranney Westcott

IPC: B23K26/04 ,  B23K26/53 ,  H01S3/06 ,  H01S3/00 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/06 ,  B23K26/067 ,  B23K26/073 ,  C03B33/02 ,  B23K103/00

Abstract: A method of laser processing a workpiece includes: focusing a pulsed laser beam into a laser beam focal line directed into the workpiece such that the laser beam focal line generates an induced absorption and produces a defect line along the laser beam focal line within the workpiece. The laser beam focal line has length L and a substantially uniform intensity profile such that the peak intensity distribution over at least 85% of the length L of the focal line does not vary by more 40%, and in some embodiments by no more than 30 or 20% from its mean peak intensity.

公开(公告)号：US11340383B2

公开(公告)日：2022-05-24

申请号：US16156210

申请日：2018-10-10

Applicant: Corning Incorporated

Inventor： Michael Morgan Dunn ,  Todd Robert McMichael ,  Paul Francis Michaloski ,  Mark Ranney Westcott

IPC: G02B1/02 ,  G02B3/00 ,  G02B7/20 ,  C03B23/22 ,  G03F7/20 ,  C03C27/00

Abstract: A compound lens assembly and method for making a compound lens assembly useful for deep ultraviolet lithography are described. The compound lens assembly includes a first lens component having an optical surface bonded to an optical surface of a second lens component. The bonding at the interface can be achieved using a hydroxide catalysis bonding technique. The compound lens assembly and process for making same solve problems relating to constringence and/or inherent birefringence known for conventional optical elements used in deep ultraviolet lithography or inspection of wafers or reticles in the DUV.

公开(公告)号：US20190137656A1

公开(公告)日：2019-05-09

申请号：US16156210

申请日：2018-10-10

Applicant: Corning Incorporated

Inventor： Michael Morgan Dunn ,  Todd Robert McMichael ,  Paul Francis Michaloski ,  Mark Ranney Westcott

IPC: G02B1/02 ,  G02B3/00 ,  G03F7/20 ,  C03B23/22

Abstract: A compound lens assembly and method for making a compound lens assembly useful for deep ultraviolet lithography are described. The compound lens assembly includes a first lens component having an optical surface bonded to an optical surface of a second lens component. The bonding at the interface can be achieved using a hydroxide catalysis bonding technique. The compound lens assembly and process for making same solve problems relating to constringence and/or inherent birefringence known for conventional optical elements used in deep ultraviolet lithography or inspection of wafers or reticles in the DUV.

公开(公告)号：US20220073401A1

公开(公告)日：2022-03-10

申请号：US17407824

申请日：2021-08-20

Applicant: CORNING INCORPORATED

Inventor： Michael Peter Gaj ,  Garrett Andrew Piech ,  Alranzo Boh Ruffin ,  Mark Christian Sanson ,  Mark Ranney Westcott

IPC: C03B33/02

Abstract: A method for processing a transparent workpiece includes directing a laser beam oriented along a beam pathway through an aspheric optical element and the transparent workpiece. The laser beam impinges the aspheric optical element radially offset from a centerline axis of the aspheric optical element by an offset distance of 30% the 1/e2 diameter of the laser beam or greater. The beam pathway and the transparent workpiece are tilted relative to one another such that the beam pathway has a beam pathway angle of less than 90° relative to an impingement surface at the impingement surface and a portion of the laser beam directed into the transparent workpiece is a laser beam focal line having an internal focal line angle of less than 80° relative to the impingement surface, such that a defect with a defect angle of less than 80° is formed by induced absorption within the transparent workpiece.

公开(公告)号：US20180062342A1

公开(公告)日：2018-03-01

申请号：US15689456

申请日：2017-08-29

Applicant: Corning Incorporated

Inventor： Lovell Elgin Comstock, II ,  Jaques Gollier ,  Thien An Thi Nguyen ,  Garrett Andrew Piech ,  Mark Ranney Westcott

IPC: H01S3/00 ,  B23K26/00 ,  B23K26/04 ,  B23K26/0622 ,  B23K26/06 ,  B23K26/064 ,  H01S3/06 ,  B23K26/067

Abstract: A method of laser processing a workpiece, the method comprising focusing a pulsed laser beam into a laser beam focal line directed into the workpiece, the laser beam focal line generating an induced absorption within the material, and the induced absorption producing a defect line along the laser beam focal line within the workpiece, wherein the focal line has length L and a substantially uniform intensity profile such that the peak intensity distribution over at least 85% of the length L of the focal line does not vary by more 40%, and preferably by no more than 30 or 20% from its mean peak intensity.