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公开(公告)号:US20240148002A1
公开(公告)日:2024-05-09
申请号:US18280414
申请日:2022-03-07
Applicant: CORNING INCORPORATED
Inventor: Bavani Balakrisnan , Stephen Joseph Caracci , David Michael Fasano , Joseph Martin Rokowski
IPC: A01N59/20 , A01N25/12 , A01N33/20 , A01N43/76 , A01N43/80 , C09D5/14 , C09D7/61 , C09D7/63 , C08K3/40 , C08K5/32 , C08K5/353 , C08K5/47 , C08K13/02
CPC classification number: A01N59/20 , A01N25/12 , A01N33/20 , A01N43/76 , A01N43/80 , C09D5/14 , C09D7/61 , C09D7/63 , C08K3/40 , C08K5/32 , C08K5/353 , C08K5/47 , C08K13/02
Abstract: A biocidal material includes a carrier, a plurality of copper-containing glass particles, and at least one co-biocide selected from isothiazolinones, bicyclic oxazolidines, and bromine nitrogen-based compounds. A minimum bactericidal concentration (MBC) of a combination of the at least one co-biocide and the plurality of copper-containing glass particles is less than an MBC of the at least one co-biocide in the absence of the plurality of copper-containing glass particles.
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公开(公告)号:US20220264889A1
公开(公告)日:2022-08-25
申请号:US17631980
申请日:2020-08-04
Applicant: Corning Incorporated
Inventor: Bavani Balakrisnan , David Michael Fasano , Bryan Patrick Livengood , Joseph Martin Rokowski
Abstract: According to various examples of the present disclosure, a biocidal dispersion includes one or more inorganic glass comprising copper particles. The biocidal dispersion further includes a dispersant, a thickener, or a mixture thereof. The inorganic glass comprising copper is homogenously distributed about the biocidal dispersion and is in a range of from about 3 wt % to about 88 wt % of the biocidal dispersion.
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公开(公告)号:US20240081336A1
公开(公告)日:2024-03-14
申请号:US17642087
申请日:2020-09-09
Applicant: Corning Incorporated
Inventor: Bavani Balakrisnan , Stephen Joseph Caracci , David Michael Fasano , Joydeep Lahiri , Joseph Martin Rokowski
Abstract: A biocidal material and method of forming is provided. The biocidal material includes a carrier and a plurality of treated copper-containing particles including a particle surface pre-treatment. The surface pre-treatment includes a copper-chelating material.
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