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公开(公告)号:US20190330096A1
公开(公告)日:2019-10-31
申请号:US16506177
申请日:2019-07-09
Applicant: CORNING INCORPORATED
Inventor: Yi-Chun Chiang , Jill Marie Hall , Fang-Yu Hsu , Shen Li , Ljerka Ukrainczyk , Hong Chih Wang
IPC: C03B23/03 , B24B19/26 , B24B37/00 , B24B1/00 , C03B11/08 , C22C19/05 , B24B37/11 , C03C3/093 , C03C3/091 , C03C3/095 , C23C8/02 , C23C8/10
Abstract: A method for treating a mold includes grinding an outer metal surface of a mold body of the mold with a first material; lapping the outer metal surface after the grinding with a second material that is finer than the first material; and polishing the outer metal surface after the lapping to achieve an average surface roughness (Ra) less than or equal to about 0.15 μm and a waviness height (Wa) less than or equal to about 100 nm. A mold for shaping glass-based material can include a mold body having an outer metal surface, wherein the outer metal surface has an average surface roughness (Ra) less than or equal to about 0.15 μm and a waviness height (Wa) less than or equal to about 100 nm.
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公开(公告)号:US10351459B2
公开(公告)日:2019-07-16
申请号:US15234114
申请日:2016-08-11
Applicant: CORNING INCORPORATED
Inventor: Yi-Chun Chiang , Jill Marie Hall , Shen Li , Ljerka Ukrainczyk , Hong Chih Wang , Fang-Yu Hsu
IPC: B24B37/11 , C03B23/03 , C03C3/091 , C22C19/05 , C03C3/095 , C03C3/093 , B24B37/00 , B24B1/00 , C03B11/08 , C23C8/10 , B24B19/26 , C23C8/02
Abstract: A method for treating a mold includes grinding an outer metal surface of a mold body of the mold with a first material; lapping the outer metal surface after the grinding with a second material that is finer than the first material; and polishing the outer metal surface after the lapping to achieve an average surface roughness (Ra) less than or equal to about 0.15 μm and a waviness height (Wa) less than or equal to about 100 nm. A mold for shaping glass-based material can include a mold body having an outer metal surface, wherein the outer metal surface has an average surface roughness (Ra) less than or equal to about 0.15 μm and a waviness height (Wa) less than or equal to about 100 nm.
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公开(公告)号:US20170044045A1
公开(公告)日:2017-02-16
申请号:US15234114
申请日:2016-08-11
Applicant: CORNING INCORPORATED
Inventor: Yi-Chun Chiang , Jill Marie Hall , Shen Li , Ljerka Ukrainczyk , Hong Chih Wang , Fang-Yu Hsu
CPC classification number: C03B23/03 , B24B1/00 , B24B19/26 , B24B37/00 , B24B37/11 , C03B11/084 , C03B11/086 , C03B2215/03 , C03B2215/06 , C03B2215/11 , C03B2215/20 , C03C3/091 , C03C3/093 , C03C3/095 , C22C19/05 , C23C8/02 , C23C8/10 , Y02P40/57
Abstract: A method for treating a mold includes grinding an outer metal surface of a mold body of the mold with a first material; lapping the outer metal surface after the grinding with a second material that is finer than the first material; and polishing the outer metal surface after the lapping to achieve an average surface roughness (Ra) less than or equal to about 0.15 μm and a waviness height (Wa) less than or equal to about 100 nm. A mold for shaping glass-based material can include a mold body having an outer metal surface, wherein the outer metal surface has an average surface roughness (Ra) less than or equal to about 0.15 μm and a waviness height (Wa) less than or equal to about 100 nm.
Abstract translation: 一种处理模具的方法包括用第一材料研磨模具的模具本体的外金属表面; 研磨后的外金属表面用比第一材料细的第二材料研磨; 并在研磨之后研磨外金属表面以达到小于或等于约0.15μm的平均表面粗糙度(Ra)和小于或等于约100nm的波纹高度(Wa)。 用于成形玻璃基材料的模具可以包括具有外金属表面的模体,其中外金属表面的平均表面粗糙度(Ra)小于或等于约0.15μm,波纹高度(Wa)小于或等于约0.15μm, 等于约100nm。
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