公开(公告)号：US20240347493A1

公开(公告)日：2024-10-17

申请号：US18383512

申请日：2023-10-25

申请人： CHIPBOND TECHNOLOGY CORPORATION

发明人： Wei-Hsin Wu ,  Ku-Pang Chang ,  Chun-Chia Yeh

IPC分类号： H01L23/00 ,  H01L23/498 ,  H05K1/11

CPC分类号： H01L24/16 ,  H01L23/49838 ,  H01L24/08 ,  H05K1/118 ,  H01L2224/0801 ,  H01L2224/08225 ,  H01L2224/16012 ,  H01L2224/16225 ,  H01L2924/3511 ,  H01L2924/384

摘要： A semiconductor package includes a flexible circuit board and a chip which includes a first bump group and a second bump group. First bumps of the first bump group and second bumps of the second bump group are provided to be bonded to leads on the flexible circuit board. The second bumps are designed to be longer than the first bumps in length so as to increase bonding strength of the second bumps to the leads, prevent the leads from being shifted and separated from the first and second bumps and prevent lead bonding misalignment.