Imaging device, method of manufacturing the same, and apparatus

    公开(公告)号:US10916574B2

    公开(公告)日:2021-02-09

    申请号:US16275652

    申请日:2019-02-14

    IPC分类号: H01L27/146

    摘要: An imaging device includes a substrate including a photoelectric conversion portion and an insulating layer formed to cover at least a part of the photoelectric conversion portion. The insulating layer contains silicon, nitrogen, and chlorine. In an embodiment, in at least a part of the insulating layer, a ratio of silicon atoms bonded to one, two, or three nitrogen atoms and not bonded to an oxygen atom is not more than 20% in silicon atoms contained in at least the part.

    Photoelectric conversion apparatus and equipment

    公开(公告)号:US10991741B2

    公开(公告)日:2021-04-27

    申请号:US16556964

    申请日:2019-08-30

    IPC分类号: H01L27/146

    摘要: A silicon compound film that is any one of a silicon oxide film, a silicon nitride film, and a silicon carbide film, and a metal compound film lying between the silicon compound film and a semiconductor layer are arranged above a main face. The silicon compound film and the metal compound film extend into a first trench, and the metal compound film extends into a second trench. When a distance from the bottom of the second trench to the silicon compound film is expressed as “Hb”, and a distance from the main face to the silicon compound film is expressed as “Hd”, the respective distances satisfy the condition “Hd

    PHOTOELECTRIC CONVERSION APPARATUS AND EQUIPMENT

    公开(公告)号:US20220231175A1

    公开(公告)日:2022-07-21

    申请号:US17575504

    申请日:2022-01-13

    IPC分类号: H01L31/02 H01B5/14 H01B1/04

    摘要: A photoelectric conversion apparatus comprises a semiconductor layer including a plurality of photoelectric conversion portions and having a first surface and a second surface that is the surface opposite to the first surface, a wiring structure disposed on the second surface side of the semiconductor layer, and a metal compound film disposed on the first surface side of the semiconductor layer. The metal compound film contains hydrogen and carbon. The concentration of the hydrogen in the interface on the semiconductor layer side of the metal compound film is 1×1021 atoms/cm3 or more and 1×1022 atoms/cm3 or less. The concentration of the carbon in the interface on the semiconductor layer side of the metal compound film is 5×1020 atoms/cm3 or more and 1×1022 atoms/cm3 or less.

    PHOTOELECTRIC CONVERSION APPARATUS AND EQUIPMENT

    公开(公告)号:US20200083263A1

    公开(公告)日:2020-03-12

    申请号:US16556964

    申请日:2019-08-30

    IPC分类号: H01L27/146

    摘要: A silicon compound film that is any one of a silicon oxide film, a silicon nitride film, and a silicon carbide film, and a metal compound film lying between the silicon compound film and a semiconductor layer are arranged above a main face. The silicon compound film and the metal compound film extend into a first trench, and the metal compound film extends into a second trench. When a distance from the bottom of the second trench to the silicon compound film is expressed as “Hb”, and a distance from the main face to the silicon compound film is expressed as “Hd”, the respective distances satisfy the condition “Hd

    IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND APPARATUS

    公开(公告)号:US20190280023A1

    公开(公告)日:2019-09-12

    申请号:US16275652

    申请日:2019-02-14

    IPC分类号: H01L27/146

    摘要: An imaging device includes a substrate including a photoelectric conversion portion and an insulating layer formed to cover at least a part of the photoelectric conversion portion. The insulating layer contains silicon, nitrogen, and chlorine. In an embodiment, in at least a part of the insulating layer, a ratio of silicon atoms bonded to one, two, or three nitrogen atoms and not bonded to an oxygen atom is not more than 20% in silicon atoms contained in at least the part.