FOREIGN SUBSTANCE REMOVING METHOD, FILM FORMING METHOD, ARTICLE MANUFACTURING METHOD, AND FOREIGN SUBSTANCE REMOVING APPARATUS

    公开(公告)号:US20240316603A1

    公开(公告)日:2024-09-26

    申请号:US18598317

    申请日:2024-03-07

    发明人: KEN KATSUTA

    IPC分类号: B08B7/00

    CPC分类号: B08B7/0014

    摘要: A method for removing a foreign substance includes forming a first trapping film between a plate and a first region where a foreign substance should be removed and separating the plate from the first region together with the first trapping film, forming a second trapping film between the plate holding the first trapping film and a second region where a foreign substance should be removed, and separating the plate from the second region together with the first trapping film and the second trapping film. The second region is larger than the first region. A value obtained by dividing a volume of the second trapping film by an area of the second region is larger than a value obtained by dividing a volume of the first trapping film by an area of the first region.

    SIMULATION APPARATUS AND STORAGE MEDIUM
    2.
    发明公开

    公开(公告)号:US20230409779A1

    公开(公告)日:2023-12-21

    申请号:US18329669

    申请日:2023-06-06

    IPC分类号: G06F30/20

    CPC分类号: G06F30/20

    摘要: A simulation apparatus that predicts a behavior of a curable composition in a film forming process includes a processor configured to execute behavior computation of the curable composition by a computational method selected from a first computational method and a second computational method which shortens a computation time as compared to the first computational method. The processor is configured to execute behavior computation of the curable composition by the second computational method while applying each of a plurality of tentative parameter sets for the film forming process, decide, from the plurality of tentative parameter sets, a parameter set that produces a result of the behavior computation satisfying a predetermined criterion for evaluation, and execute behavior computation of the curable composition by the first computational method while applying the decided parameter set.