公开(公告)号：US20220389592A1

公开(公告)日：2022-12-08

申请号：US17727003

申请日：2022-04-22

申请人： C. Uyemura & Co., Ltd.

发明人： Takuya Komeda ,  Tetsuji Ishida ,  Hisamitsu Yamamoto ,  Kazunari Kato ,  Ryoyu Shimizu

IPC分类号： C23F1/18

摘要： A copper etching solution contains an oxidizing agent and an amine compound. The oxidizing agent is one or more selected from the group consisting of a perchlorate, a chlorate, a chlorite, a hypochlorite, hydrogen peroxide, and a perborate, and the amine compound has one or more primary amino groups or secondary amino groups.

公开(公告)号：US10138558B2

公开(公告)日：2018-11-27

申请号：US15549471

申请日：2016-01-25

申请人： C. Uyemura & Co., Ltd.

发明人： Yoshikazu Saijo ,  Hisamitsu Yamamoto ,  Tetsuji Ishida ,  Takuya Komeda ,  Masayuki Utsumi

IPC分类号： C23C18/20 ,  H05K3/18 ,  H05K3/38 ,  C23C18/22 ,  C23C18/38

摘要： The ampholytic surfactants show the nature of anionic surfactants in an alkaline region and the nature of cationic surfactants in an acidic region. As described below, the pretreatment solution of the present invention may preferably indicate alkalinity of pH 8.5 or higher, and therefore, it exhibits the nature of cationic surfactants by the use of ampholytic surfactants. As the ampholytic surfactants, those disclosed in JP 2011-228517 A can be used.