- 专利标题: COPPER ETCHING SOLUTION
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申请号: US17727003申请日: 2022-04-22
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公开(公告)号: US20220389592A1公开(公告)日: 2022-12-08
- 发明人: Takuya Komeda , Tetsuji Ishida , Hisamitsu Yamamoto , Kazunari Kato , Ryoyu Shimizu
- 申请人: C. Uyemura & Co., Ltd.
- 申请人地址: JP Osaka
- 专利权人: C. Uyemura & Co., Ltd.
- 当前专利权人: C. Uyemura & Co., Ltd.
- 当前专利权人地址: JP Osaka
- 优先权: JP2021-092590 20210601
- 主分类号: C23F1/18
- IPC分类号: C23F1/18
摘要:
A copper etching solution contains an oxidizing agent and an amine compound. The oxidizing agent is one or more selected from the group consisting of a perchlorate, a chlorate, a chlorite, a hypochlorite, hydrogen peroxide, and a perborate, and the amine compound has one or more primary amino groups or secondary amino groups.
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