摘要:
A probe for an array of interconnecting leads between a PCA and an IC has one or more contacts extending laterally from or plated upon one or more arms formed of a flexible printed circuit, and connected by traces along the arm(s) to a header that itself affords connection to measurement equipment. The flexible printed circuit is thin enough to loosely slide between the top of the PCA or PCB and the bottom of the IC. The arm or arms is/are narrow enough to slide between the adjacent leads forming the array, while the normally flat contacts will successively interfere with, to engage and electrically contact, consecutive layers of leads as the probe is progressively inserted. An arm is not so stiff that it cannot yield by a slight compressive warping as the contacts encounter leads. Indexing may be ‘by feel’ or by visible indicia along a top surface of the probe or by a reticle device that moves over the top of the IC, which then has a pattern of indicia corresponding to lead location. Forming the shape of a Kapton substrate may also include use of a CVL operating in the range of 250 nm to 290 nm for the creation of extended copper contacts by the removal of underlying Kapton. Plating processes may also be used in the fabrication of (non-extended) wrap-around contacts at the edges of the Kapton.
摘要:
Probe accessories, and methods for routing signals between a target and a test instrument using the probe accessories, are disclosed. Some of the probe accessories include a flexible circuit and first and second pairs of contacts. Flexible circuit design varies, but one embodiment has first and second regions, a first conductor and a second conductor, and a separation feature. The first conductor extends into the first region while the second conductor extends into both the first and second regions and has a fixed spacing with respect to the first conductor. A separation feature extends between first and second regions and is operable to create two independently maneuverable legs, each leg comprising an end portion of the first and second regions, while maintaining a fixed spacing between the first and second conductors. The first and second pairs of contacts electrically couple the probe accessories between test points and test instruments.
摘要:
A probe apparatus has first and second access ports and a measurement port. The first and second access ports are adapted to be interposed in a test circuit. A voltage amplifier and a voltage splitter are adapted to present the second access port and the measurement port each with a voltage representative of a voltage received by the first access port.
摘要:
Uncontrolled characteristic impedance along a spring biased pin probe assembly is avoided by providing a stepped shelf of ground plane that extends outward along the pin and toward the target signal. The length of outward extension is chosen such that even when there is only (or at least) an expected minimum amount of compression of the spring while producing and maintaining contact, the entire exposed portion of the pin is over the shelf, whose depth of step has been selected to produce a selected Z0 for the exposed pin that matches Z0 for existing transmission lines already within the probe assembly. The spring biased pin may be a resistor tip spring pin that includes a small resistor in its tip.
摘要:
A probe for probing test points on a target board uses a printed circuit board (PCB) having a plurality of signal routes for routing signals to a test instrument. The probe also has a plurality of spring pins for probing the test points on the target board. Each of the spring pins is i) disposed perpendicularly to the PCB, and ii) electrically coupled to at least one signal route of the PCB. By way of example, the spring pins may be fit into holes in the PCB or, alternately, they may be electrically coupled to signal routes of a second PCB that is perpendicularly abutted to the first PCB. Methods for making and using such probes are also disclosed.
摘要:
An alignment/retention device. The device includes a housing having a first side and an opposing second side. The housing includes an opening which extends from the first side to the second side. Multiple alignment pins are imbedded in the housing and extend external to both the first and second sides. On the first side the alignment pins are capable of insertion into matching holes on an electronic probe, and on the second side the alignment pins are capable of insertion into matching holes on an electronic circuit assembly.
摘要:
An integrated probe assembly provides the capability to test integrated circuit (IC) packages mounted onto ball grid arrays. The present invention comprises an unsealed BGA socket (102), nail head pins (107) which can be inserted flush into a pin carrier to produce a PGA header (103), a Flex circuit assembly comprising a piece of flexible circuit (104) with various passive resistors and connectors attached and solder preforms (113) used to solder the flex assembly to the pin grid array. Matched impedance connectors (105) are attached at an end of the flexible circuit.
摘要:
A connector-less probe is disclosed. The probe permits probing of a board or bus without the use of a mating connector. The probe has a support attached to the probing end of the probe. A spring pin and an isolation network are attached to the support. The support is arranged substantially perpendicular to a target board during probing of a test point on the target board. The spring pin engages the test point on the target board. The spring pin is arranged substantially perpendicular to the target board when the spring pin engages the test point on the target board, and the spring pin is securely attached to the support so that the spring pin is substantially parallel to the support. The isolation network is electrically coupled to the spring pin so that the spring pin is located between the isolation network and the test point during probing of the test point. The isolation network is also securely attached to the support.
摘要:
The method of the invention comprises the steps of soldering a BGA socket onto a PGA header, inserting a flex assembly onto the BGA-PGA assembly, placing solder preforms over the PGA pins and then reflowing the flex assembly to the BGA-PGA assembly.