COOLING SYSTEM EMPLOYABLE IN DATA CENTER
    1.
    发明申请

    公开(公告)号:US20180295752A1

    公开(公告)日:2018-10-11

    申请号:US15889914

    申请日:2018-02-06

    Abstract: The present disclosure discloses a cooling system employable in data centers. An specific embodiment of the cooling system comprises: a first refrigeration medium, a first evaporator, a first condenser, and an all-condition cooling tower, wherein: the first evaporator is installed in a to-be-cooled space, the first evaporator is connected to the first condenser, an installation position of the first condenser is higher than an installation position of the first evaporator; the first condenser is connected to the all-condition cooling tower, and the all-condition cooling tower is disposed outside the to-be-cooled space, the all-condition cooling tower is used for providing the first condenser with a cold source for cooling the first refrigeration medium in a gaseous state. The cooling system provided by the embodiment has the advantages of simple structure, convenient installation and maintenance and low cost.

    Refrigeration system and refrigeration method for data center

    公开(公告)号:US11266042B2

    公开(公告)日:2022-03-01

    申请号:US16226328

    申请日:2018-12-19

    Abstract: A refrigeration system and refrigeration method for a data center are disclosed. The refrigeration system includes: a first heat exchanger disposed on a back plate of an indoor cabinet of the data center, and a phase-change heat-exchange cooling tower disposed outdoor of the data center. The first heat exchanger and the phase-change heat-exchange cooling tower are communicated by a secondary refrigerant delivery pipeline. The phase-change heat-exchange cooling tower transfers heat carried in the secondary refrigerant into air and condenses the secondary refrigerant to a liquid again; the secondary refrigerant employs a phase-change heat-exchange working medium. An air pump is disposed in the phase-change heat-exchange cooling tower and on a by-pass of the secondary refrigerant delivery pipeline to pressurize the secondary refrigerant in gas-state delivered in the secondary refrigerant delivery pipeline to increase the condensing pressure for condensing the secondary refrigerant to a liquid again.

    COOLING SYSTEM EMPLOYABLE IN DATA CENTER

    公开(公告)号:US20210400849A1

    公开(公告)日:2021-12-23

    申请号:US17403525

    申请日:2021-08-16

    Abstract: A cooling system, including a first refrigeration medium, a first evaporator, a first condenser, and an all-condition cooling tower. The first evaporator is installed in a to-be-cooled space, the first evaporator is connected to the first condenser, an installation position of the first condenser is higher than an installation position of the first evaporator; the first condenser is connected to the all-condition cooling tower, and the all-condition cooling tower is disposed outside the to-be-cooled space, the all-condition cooling tower is used for providing the first condenser with a cold source for cooling the first refrigeration medium in a gaseous state.

    Machine cabinet for dissipating heat

    公开(公告)号:US10143112B2

    公开(公告)日:2018-11-27

    申请号:US15279221

    申请日:2016-09-28

    Abstract: The machine cabinet for dissipating heat includes a housing, and an inner chamber, a liquid working medium accommodating area, a heat exchanger and a delivery passage disposed in the housing. The inner chamber is in a vacuum state and accommodates electronic devices to be cooled; the liquid working medium accommodating area accommodates a liquid working medium, the liquid working medium is converted into a gas working medium to enter the heat exchanger after cooling the electronic devices to be cooled; the heat exchanger liquefies the gas working medium into a liquid working medium and guides the liquid working medium obtained by liquefying the gas working medium into the delivery passage; and the delivery passage is connected with the heat exchanger and the liquid working medium accommodating area and guides the liquid working medium obtained by liquefying the gas working medium into the liquid working medium accommodating area.

Patent Agency Ranking