公开(公告)号：US20140087676A1

公开(公告)日：2014-03-27

申请号：US13628488

申请日：2012-09-27

Applicant: BROADCOM CORPORATION

Inventor： Farid SHIRINFAR ,  Med NARIMAN ,  Maryam ROFOUGARAN ,  Ahmadreza ROFOUGARAN

IPC: H04B1/04

CPC classification number: H04B1/0483 ,  H04B1/0458

Abstract: A transmitter front-end for wireless chip-to-chip communication, and potentially for other, longer range (e.g., several meters or several tens of meters) device-to-device communication, is disclosed. The transmitter front-end includes a distributed power amplifier capable of providing an output signal with sufficient power for wireless transmission by an on-chip or on-package antenna to another nearby IC chip or device located several meters or several tens of meters away. The distributed power amplifier can be fully integrated (i.e., without using external components, such as bond wire inductors) on a monolithic silicon substrate using, for example, a complementary metal oxide semiconductor (CMOS) process.

Abstract translation: 公开了一种用于无线芯片到芯片通信的发射机前端，并且潜在地用于其他较长距离（例如，几米或几十米）的设备到设备通信。 发射机前端包括分布式功率放大器，其能够提供具有足够功率的输出信号，用于通过片上或封装内天线到距离几米或几十米远的另外附近的IC芯片或设备的无线传输。 分布式功率放大器可以使用例如互补金属氧化物半导体（CMOS）工艺，在单片硅衬底上完全集成（即，不使用外部组件，例如接合线电感器）。