公开(公告)号：US12103240B2

公开(公告)日：2024-10-01

申请号：US17294764

申请日：2019-11-20

申请人： BRANSON ULTRASONICS CORPORATION ,  ORIHIRO ENGINEERING CO., LTD.

发明人： Toshiyuki Masunaga ,  Suguru Saiki ,  Masataka Tsuruta ,  Tsubasa Shintani

IPC分类号： B29C65/08 ,  B29C65/20 ,  B29C65/72

CPC分类号： B29C65/08 ,  B29C65/20 ,  B29C65/72

摘要： Provided is a bonding method capable of bonding with an inexpensive structure while avoiding an increase in the overall size of the device. The bonding method comprises: an arrangement step for locating a cylindrical body between two sheet-shaped members; a cylindrical body bonding step for applying an ultrasonic wave from the outer surface of a first sheet-shaped member through a horn part and applying heat from the outer surface of a second sheet-shaped member through an anvil part, in a state in which the cylindrical body is arranged between the two sheet-shaped members; and a shoulder part bonding step for directly bonding, through a pair of heating parts, the two sheet-shaped members to each other while the two sheet-shaped members are interposed between the pair of heating parts.