Organic light emitting device, manufacturing method thereof and display device

    公开(公告)号:US09985245B2

    公开(公告)日:2018-05-29

    申请号:US14761881

    申请日:2015-01-07

    Inventor: Yulin Wang

    CPC classification number: H01L51/5253 H01L27/32 H01L51/56

    Abstract: The present invention provides an organic light emitting device, a manufacturing method thereof and a display device. In the organic light emitting device provided by the present invention, a first inorganic thin film entirely covers a pre-encapsulation layer and an organic light emitting unit, and the first inorganic thin film has a denser molecular structure compared with the pre-encapsulation layer, thereby more effectively preventing water and oxygen from invading the organic light emitting unit via the pre-encapsulation layer to influence the service life of the organic light emitting unit.

    Packaging method of OLED display device using sacrificial layer in bonding region

    公开(公告)号:US10923681B2

    公开(公告)日:2021-02-16

    申请号:US16328038

    申请日:2018-05-29

    Inventor: Yulin Wang

    Abstract: The present disclosure provides a package structure and a packaging method of OLED display device, and a display device. The packaging method of OLED display device includes providing a substrate including a package region and a bonding region around the package region, the package region being provided with a bonding electrode lead; forming a sacrificial layer on the bonding electrode lead; forming an OLED display device in the package region; forming a packaging film which covers the package region and the bonding region; and removing the sacrificial layer to separate the sacrificial layer and a part of the packaging film positioned on the sacrificial layer from the substrate. The packaging method of OLED display device provided is used for packaging OLED display devices.

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