Abstract:
The present disclosure provides a stretchable display substrate and a manufacturing method. The stretchable display substrate includes: a base substrate, a plurality of opening patterns being distributed on the base substrate, a plurality of bridges being formed between adjacent ones of at least a part of opening patterns in the plurality of opening patterns to define islands; a plurality of display units, at least one display unit being arranged on each island; a plurality of wiring units each coupled between the display units on the islands and arranged on the bridge; and a thin film encapsulation layer including a first encapsulation portion covering a side of each display unit away from the base substrate and a second encapsulation portion at least covering a side of each display unit adjacent to the opening pattern. Each of at least a part of opening patterns has different opening sizes at a side of the base substrate adjacent to the display unit and a side of the base substrate away from the display unit, and the opening pattern has at least one step-like structure at a side adjacent to the island. According to the present disclosure, it is able to improve the reliability of a display element.
Abstract:
An adhesive storage tank includes: an accommodation part for accommodating an adhesive; a stirring device disposed in the accommodation part; and a vacuum device for suctioning gas from the accommodation part.
Abstract:
An anode includes at least one first electrode, and a reflecting electrode disposed on a side of the at least one first electrode configured to face a light emitting portion of the light emitting device.
Abstract:
The present disclosure is related to an encapsulating method that may include forming an inorganic film layer covering a structure to be encapsulated. The inorganic film layer may include at least two sub-film layers. Among the at least two sub-film layers, densification of a sub-film layer farther away from the structure to be encapsulated may be greater than densification of a sub-film layer closer to the structure to be encapsulated.
Abstract:
An OLED display substrate, a method for manufacturing the same, and a display device are provided. The OLED display substrate includes multiple sub-pixels, and at least one sub-pixel includes: an anode, a cathode, and a light-emitting layer between the anode and the cathode. The anode includes: a light-reflective layer and a first transparent conductive layer covering the light-reflective layer, and the first transparent conductive layer is located between the light-reflective layer and the light-emitting layer. First vertical distances between first surfaces of the first transparent conductive layers of the subpixels of different colors facing the respective cathodes and the respective cathodes are the same, and second vertical distances between the first surfaces of the first transparent conductive layers of the subpixels of different colors and second surfaces of the respective light-reflective layers facing the respective cathodes are different.
Abstract:
The present disclosure is related to an encapsulating method that may include forming an inorganic film layer covering a structure to be encapsulated. The inorganic film layer may include at least two sub-film layers. Among the at least two sub-film layers, densification of a sub-film layer farther away from the structure to be encapsulated may be greater than densification of a sub-film layer closer to the structure to be encapsulated.
Abstract:
The present disclosure relates to an organic light emitting panel, including: an organic layer, a first electrode disposed on one side of the organic layer, and a second electrode disposed on the other side of the organic layer. The second electrode includes a buffer electrode layer and a conductive electrode layer sequentially stacked on the organic layer.
Abstract:
An electroluminescent device, a display panel and a display apparatus are disclosed. The electroluminescent device includes: a substrate; an anode on the substrate; a luminescent layer on a side of the anode facing away from the substrate; and a cathode on a side of the luminescent layer facing away from the substrate. The cathode includes a transflective layer on the side of the luminescent layer facing away from the substrate; and a light-emission enhancement layer on a side of the transflective layer facing away from the substrate. The anode is configured to reflect light incident thereon, a material of the transflective layer includes metal, and the transflective layer is configured to transmit a first portion of light incident thereon and to reflect a second portion of the light incident thereon.
Abstract:
An encapsulation method of an organic light emitting diode, an organic light emitting diode encapsulation structure and an organic light emitting diode display apparatus are provided. The encapsulation method includes: providing an encapsulation cover plate and a base substrate with an organic light emitting diode device; forming a first sealant of the encapsulation cover plate, in which the first sealant includes a plurality of protrusion portions spaced apart with each other; forming a second sealant on the encapsulation cover plate, in which the second sealant includes a plurality of protrusion portions and a height of each of the plurality of protrusion portions of the second sealant is greater than a height of each of the plurality of protrusion portions of the first sealant; and bonding the encapsulation cover plate and the base substrate, in which the second sealant covers the organic light emitting diode device and the first sealant.
Abstract:
An electroluminescent device, a display panel and a display apparatus are disclosed. The electroluminescent device includes: a substrate; an anode on the substrate; a luminescent layer on a side of the anode facing away from the substrate; and a cathode on a side of the luminescent layer facing away from the substrate. The cathode includes a transflective layer on the side of the luminescent layer facing away from the substrate; and a light-emission enhancement layer on a side of the transflective layer facing away from the substrate. The anode is configured to reflect light incident thereon, a material of the transflective layer includes metal, and the transflective layer is configured to transmit a first portion of light incident thereon and to reflect a second portion of the light incident thereon.