An encapsulation method of an organic light emitting diode, an organic light emitting diode encapsulation structure and an organic light emitting diode display apparatus are provided. The encapsulation method includes: providing an encapsulation cover plate and a base substrate with an organic light emitting diode device; forming a first sealant of the encapsulation cover plate, in which the first sealant includes a plurality of protrusion portions spaced apart with each other; forming a second sealant on the encapsulation cover plate, in which the second sealant includes a plurality of protrusion portions and a height of each of the plurality of protrusion portions of the second sealant is greater than a height of each of the plurality of protrusion portions of the first sealant; and bonding the encapsulation cover plate and the base substrate, in which the second sealant covers the organic light emitting diode device and the first sealant.