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公开(公告)号：US10205029B2
公开(公告)日：2019-02-12
申请号：US15511683
申请日：2016-01-19
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Jiushi Wang , Dalin Cui
IPC: H01L29/786 , G02F1/1333 , H01L27/12 , H01L29/10
Abstract: A TFT, a manufacturing method thereof, and a display device are provided. The TFT includes a semiconductor layer and an etch-stop layer merely covering a channel region of the semiconductor layer. The semiconductor layer and the etch-stop layer are formed through a single patterning process.
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公开(公告)号：US20190062919A1
公开(公告)日：2019-02-28
申请号：US15954303
申请日：2018-04-16
Inventor： Shanshan Yang , Dalin Cui
CPC classification number: C23C16/46 , H01J37/32724 , H01J2237/3321
Abstract: A coating apparatus includes a coating chamber, and a substrate support structure and a heater in the coating chamber. The substrate support structure includes a plurality of support units. The heater includes a heating plate body having a plurality of through holes and heating filling parts each provided in one of the plurality of through holes, and the plurality of support units are received in the plurality of through holes respectively. In each of the plurality of through holes, one of the plurality of support units is located between one of the heating filling parts and an inner wall of the through hole accommodating the one of the heating filling parts, and the heater further includes connection parts each configured to connect one of the heating filling parts with the inner wall of the through holes accommodating the one of the heating filling parts.
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公开(公告)号：US10415139B2
公开(公告)日：2019-09-17
申请号：US15954303
申请日：2018-04-16
Inventor： Shanshan Yang , Dalin Cui
Abstract: A coating apparatus includes a coating chamber, and a substrate support structure and a heater in the coating chamber. The substrate support structure includes a plurality of support units. The heater includes a heating plate body having a plurality of through holes and heating filling parts each provided in one of the plurality of through holes, and the plurality of support units are received in the plurality of through holes respectively. In each of the plurality of through holes, one of the plurality of support units is located between one of the heating filling parts and an inner wall of the through hole accommodating the one of the heating filling parts, and the heater further includes connection parts each configured to connect one of the heating filling parts with the inner wall of the through holes accommodating the one of the heating filling parts.
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