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1.
公开(公告)号:US20220059728A1
公开(公告)日:2022-02-24
申请号:US17340672
申请日:2021-06-07
Applicant: BOE Technology Group Co., Ltd.
Inventor: Lubin SHI , Bin QIN , Liang CHEN , Dongni LIU , Fangzhen ZHANG , Ke WANG
IPC: H01L33/48 , H01L25/075
Abstract: A displaying base plate and a fabricating method thereof. The displaying base plate includes a substrate, and a first flat layer on one side of the substrate; a first metal layer on one side of the first flat layer that is further away from the substrate; a second flat layer on sides of the first metal layer and the first flat layer that are further away from the substrate; and a second metal layer on one side of the second flat layer that is further away from the substrate; wherein the first metal layer includes a first metal trace, an orthographic projection of the second metal layer on the substrate and an orthographic projection of the first metal trace on the substrate have an overlapping part, and an orthographic projection of the second flat layer on the substrate covers the orthographic projection of the first metal trace on the substrate.
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公开(公告)号:US20240412682A1
公开(公告)日:2024-12-12
申请号:US18273989
申请日:2022-07-07
Applicant: BOE Technology Group Co., Ltd.
Inventor: Weixing LIU , Kuanjun PENG , Bin QIN , Kai GUO , Tieshi WANG , Fangzhen ZHANG
IPC: G09G3/32 , H01L25/075 , H01L25/16 , H01L33/62
Abstract: A display substrate (910), comprising a plurality of pixel units (P11, P12, P21, P22) and at least one compensation circuit. At least one pixel unit (P11, P12, P21, P22) comprises: a main light-emitting unit and an auxiliary light-emitting unit; and the at least one compensation circuit is connected to the auxiliary light-emitting unit of the at least one pixel unit (P11, P12, P21, P22). The at least one compensation circuit is configured to measure the brightness or temperature of the at least one pixel unit (P11, P12, P21, P22) and control the auxiliary light-emitting unit of the at least one pixel unit (P11, P12, P21, P22) to emit light according to a measurement result.
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公开(公告)号:US20240222570A1
公开(公告)日:2024-07-04
申请号:US17920811
申请日:2021-11-30
Applicant: BOE Technology Group Co., Ltd.
Inventor: Yanan NIU , Yan QU , Ming YANG , Jintao PENG , Bin QIN , Wanzhi CHEN
IPC: H01L33/48 , H01L25/075 , H01L33/20 , H01L33/54 , H01L33/62
CPC classification number: H01L33/486 , H01L25/0753 , H01L33/20 , H01L33/54 , H01L33/62 , H01L2933/0066
Abstract: A light emitting substrate, a preparation method therefor, and a display device are provided. The light emitting substrate includes a base substrate, a die bonding structure, a light shielding structure and a light emitting chip disposed on the base substrate, wherein the light emitting chip is disposed at a side of the die bonding structure away from the base substrate, the light shielding structure is located at a peripheral side of the light emitting chip, the light emitting substrate further comprises a flux functional layer covering the side of the die bonding structure away from the base substrate, the light shielding structure comprises a shielding material layer and a partition structure, and the flux functional layer is blocked at the partition structure.
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公开(公告)号:US20230274696A1
公开(公告)日:2023-08-31
申请号:US18014254
申请日:2021-11-22
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Weixing LIU , Kuanjun PENG , Bin QIN , Xue DONG , Fangzhen ZHANG , Wanpeng TENG , Tieshi WANG , Wanzhi CHEN , Kai GUO , Chunfang ZHANG
IPC: G09G3/3233 , H01L27/15 , H01L33/06 , H01L33/38
CPC classification number: G09G3/3233 , H01L27/156 , H01L33/06 , H01L33/38 , G09G2300/0819 , G09G2300/0842 , G09G2310/0262 , G09G2310/08 , G09G2300/0426 , G09G2320/0233
Abstract: A pixel driving circuit includes a data writing circuit, a light-emitting control circuit and a light-emitting diode chip. The data writing circuit is electrically connected to a first scanning signal terminal, a data signal terminal and a first node. The light-emitting control circuit is electrically connected to the first node, an enable signal terminal, a first voltage signal terminal and a second node, and is configured to transmit a first voltage signal received at the first voltage signal terminal to the second node. The light-emitting diode chip is electrically connected to the second node and a second voltage signal terminal. The light-emitting diode chip includes a plurality of light-emitting portions. The light-emitting diode chip is configured to drive the plurality of light-emitting portions to emit light in different periods of time respectively or drive at least two light-emitting portions to emit light in a same period of time.
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公开(公告)号:US20240186454A1
公开(公告)日:2024-06-06
申请号:US17789351
申请日:2021-05-31
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Weixing LIU , Kuanjun PENG , Xiaolong LI , Wanpeng TENG , Bin QIN , Wanzhi CHEN , Fangzhen ZHANG , Chunfang ZHANG , Zhiqiang XU
IPC: H01L33/38 , G09G3/32 , H01L25/075 , H01L33/62
CPC classification number: H01L33/382 , G09G3/32 , H01L25/0753 , H01L33/62 , G09G2300/0819 , G09G2300/0852 , G09G2320/0626 , G09G2330/021
Abstract: A light-emitting device includes a first semiconductor layer, a light-emitting functional layer and a second semiconductor layer that are stacked. The first semiconductor layer includes a first semiconductor pattern and a second semiconductor pattern. The light-emitting functional layer includes a first light-emitting pattern and a second light-emitting pattern spaced apart. The second semiconductor layer includes a third semiconductor pattern and a fourth semiconductor pattern spaced apart. Orthographic projections of the first semiconductor pattern, the first light-emitting pattern and the third semiconductor pattern on a reference plane at least partially overlap to form a first light-emitting portion. Orthographic projections of the second semiconductor pattern, the second light-emitting pattern and the fourth semiconductor pattern on the reference plane at least partially overlap to form a second light-emitting portion. The reference plane is parallel to a plane where the first semiconductor layer is located.
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公开(公告)号:US20250040317A1
公开(公告)日:2025-01-30
申请号:US18272570
申请日:2022-06-29
Applicant: BOE Technology Group Co., Ltd.
Inventor: Yanan NIU , Yan QU , Dongni LIU , Jinqian WANG , Jing NIU , Tingting ZHOU , Shuang SUN , Bin QIN , Hongwei TIAN , Fangzhen ZHANG , Wei WANG
Abstract: The present disclosure provides a display apparatus and a display panel. The display panel includes: a drive backplate, including a substrate and a drive circuit layer on the substrate, where the drive circuit layer includes drive circuit regions arranged at intervals and transparent regions around the drive circuit regions, the transparent region includes concave parts, and a number of layers in the respective concave parts of the drive circuit layer is less than a number of layers in the respective drive circuit regions; a side of the drive circuit regions of the drive circuit layer away from the substrate includes pads for connecting a light-emitting unit; a light-transmissive glue for filling the concave parts, and a surface of the light-transmissive glue away from the substrate is on a side of the pads away from the substrate. The present disclosure can improve display effect.
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公开(公告)号:US20240276775A1
公开(公告)日:2024-08-15
申请号:US18023381
申请日:2022-03-16
Applicant: BOE Technology Group Co., Ltd.
Inventor: Jintao PENG , Yanan NIU , Zhikun GAO , Tingting ZHOU , Bin QIN , Shuang SUN
IPC: H10K59/122 , H10K59/35
CPC classification number: H10K59/122 , H10K59/35
Abstract: A display substrate includes a light emitting structure layer arranged on a base substrate, the light emitting structure layer includes a first electrode layer, a pixel definition layer, a light emitting functional layer, a second electrode layer, a third electrode layer and an electrode insulation layer; the first electrode layer includes multiple first electrodes, and the pixel definition layer is provided with a pixel opening exposing a first electrode and a grid-shaped isolation groove structure; the third electrode layer and the electrode insulation layer are sequentially stacked on a side of the pixel definition layer; the light emitting functional layer and the second electrode layer are sequentially stacked; the second electrode layer and the third electrode layer are configured to be equipotential; the light emitting functional layer includes at least two stacked light emitting units and a charge generation layer positioned between two adjacent light emitting units.
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8.
公开(公告)号:US20240088328A1
公开(公告)日:2024-03-14
申请号:US18263567
申请日:2021-10-22
Applicant: BOE Technology Group Co., Ltd.
Inventor: Bin QIN , Kuanjun PENG , Weixing LIU , Fangzhen ZHANG , Xue DONG , Jintao PENG , Wanpeng TENG , Xiaolong LI , Shuang SUN , Wanzhi CHEN , Guangcai YUAN , Qian JIA
CPC classification number: H01L33/385 , H01L27/15 , H01L33/06 , H01L33/145 , H01L33/54 , H01L33/60 , H01L33/62 , H01L33/642
Abstract: A light-emitting device, a light-emitting substrate, and a method for manufacturing the light-emitting device. The light-emitting device includes at least one light-emitting structure. The light-emitting structure includes: a first semiconductor layer; a light-emitting layer; a second semiconductor layer, doping ions of the second semiconductor layer and a first semiconductor layer being oppositely charged; a barrier structure provided with an opening for exposing the second semiconductor layer, the orthographic projection of the opening on the base substrate being located in the orthographic projection of the light-emitting layer on the base substrate, and the area of the opening being smaller than that of the light-emitting layer; and a landing electrode located on the side of the barrier structure facing away from the second semiconductor layer, the landing electrode being in contact with the second semiconductor layer by means of the opening.
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公开(公告)号:US20210265439A1
公开(公告)日:2021-08-26
申请号:US17255866
申请日:2020-04-10
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Jintao PENG , Yanan NIU , Kuanjun PENG , Kai GUO , Bin QIN , Xiaolong LI , Wanpeng TENG
IPC: H01L27/32
Abstract: The present disclosure provides a pixel compensation circuit and a manufacturing method thereof, an OLED array substrate and a manufacturing method thereof, and a display device. The pixel compensation circuit includes a first TFT and a second TFT on a substrate. The first TFT includes: a first electrode on the substrate, a first interlayer dielectric layer on a side of the first electrode away from the substrate and having an opening exposing at least a portion of the first electrode; a second electrode on a side of the first interlayer dielectric layer away from the first electrode; and an active layer extending from the second electrode to the first electrode. The second TFT includes: an active layer on the substrate; and a first electrode and a second electrode in a same layer and on a side of the active layer of the second TFT away from the substrate.
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公开(公告)号:US20250081686A1
公开(公告)日:2025-03-06
申请号:US18250446
申请日:2022-06-30
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Yanan NIU , Yan QU , Jing NIU , Tingting ZHOU , Shuang SUN , Wei WANG , Hongwei TIAN , Bin QIN
IPC: H01L33/54 , H01L25/075 , H01L25/16 , H01L33/00 , H01L33/62
Abstract: A display panel is disclosed and includes a driving backplane, a plurality of light-emitting devices and an encapsulation structure. The plurality of light-emitting devices are located on a first side of the driving backplane and are disposed at intervals. A light-emitting device includes a device main body and device pins. The device main body includes a light-emitting portion, and the device pins are electrically connected to the driving backplane. The encapsulation structure is located on the first side of the driving backplane and includes a light-shielding pattern and a plurality of encapsulation portions. The light-shielding pattern has a plurality of accommodation regions, an accommodation region exposes at least one light-emitting device. At least part of an encapsulation portion is located in the accommodation region and covers the light-emitting device. A light-emitting portion of at least one light-emitting device is located in the accommodation region.
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