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公开(公告)号：US20210176386A1
公开(公告)日：2021-06-10
申请号：US17108672
申请日：2020-12-01
Applicant: BIO-RAD LABORATORIES, INC.
Inventor： Stephen Swihart , Li Lu , Wade Jameson , Evan Thrush , Michael Griffin , Evelio Perez
Abstract: An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.
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公开(公告)号：US11956522B2
公开(公告)日：2024-04-09
申请号：US18063946
申请日：2022-12-09
Applicant: BIO-RAD LABORATORIES, INC.
Inventor： Stephen Swihart , Li Lu , Wade Jameson , Evan Thrush , Michael Griffin , Evelio Perez
CPC classification number: H04N23/52 , H04N23/55 , H05K7/20472
Abstract: An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.
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公开(公告)号：US20240334032A1
公开(公告)日：2024-10-03
申请号：US18629257
申请日：2024-04-08
Applicant: BIO-RAD LABORATORIES, INC.
Inventor： Stephen Swihart , Li Lu , Wade Jameson , Evan Thrush , Michael Griffin , Evelio Perez
CPC classification number: H04N23/52 , H04N23/55 , H05K7/20472
Abstract: An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.
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公开(公告)号：US11553116B2
公开(公告)日：2023-01-10
申请号：US17108672
申请日：2020-12-01
Applicant: BIO-RAD LABORATORIES, INC.
Inventor： Stephen Swihart , Li Lu , Wade Jameson , Evan Thrush , Michael Griffin , Evelio Perez
Abstract: An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.
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