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公开(公告)号：US11212454B2
公开(公告)日：2021-12-28
申请号：US16597665
申请日：2019-10-09
Applicant: Bio-Rad Laboratories, Inc.
Inventor： Michael Griffin , Stephen Swihart
IPC: H04N5/235
Abstract: A method of image capture helps avoid saturation in digital imaging. In one implementation, the method includes capturing a first digital image of a target using an electronic array light sensor, and identifying one or more saturated pixels in the first digital image. The method further includes identifying a region of interest in the first digital image, the region of interest encompassing the one or more identified saturated pixels. The method also includes capturing a second digital image of the target using the electronic array light sensor. The second digital image encompasses only the region of interest, and the second digital image is captured with a shorter exposure time than the first digital image. The first and second digital images may be combined into a high dynamic range image. Systems for digital imaging may be based on complementary metal oxide semiconductor (CMOS) or charge coupled device (CCD) sensors.
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公开(公告)号：US20210176386A1
公开(公告)日：2021-06-10
申请号：US17108672
申请日：2020-12-01
Applicant: BIO-RAD LABORATORIES, INC.
Inventor： Stephen Swihart , Li Lu , Wade Jameson , Evan Thrush , Michael Griffin , Evelio Perez
Abstract: An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.
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Patent Agency Ranking
公开(公告)号：US20240334032A1
公开(公告)日：2024-10-03
申请号：US18629257
申请日：2024-04-08
Applicant: BIO-RAD LABORATORIES, INC.
Inventor： Stephen Swihart , Li Lu , Wade Jameson , Evan Thrush , Michael Griffin , Evelio Perez
CPC classification number: H04N23/52 , H04N23/55 , H05K7/20472
Abstract: An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.
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公开(公告)号：US11553116B2
公开(公告)日：2023-01-10
申请号：US17108672
申请日：2020-12-01
Applicant: BIO-RAD LABORATORIES, INC.
Inventor： Stephen Swihart , Li Lu , Wade Jameson , Evan Thrush , Michael Griffin , Evelio Perez
Abstract: An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.
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公开(公告)号：US12015751B2
公开(公告)日：2024-06-18
申请号：US18082330
申请日：2022-12-15
Applicant: Bio-Rad Laboratories, Inc.
Inventor： Stephen Swihart , Evan Thrush , Carl Marlowe , Kenneth Oh , Michael Griffin
IPC: H04N1/10 , G06T5/50 , G06V10/141 , H04N1/028
CPC classification number: H04N1/1008 , G06T5/50 , G06V10/141 , H04N1/02865 , G06T2207/20221
Abstract: Systems and methods for contact imaging of stands with illumination are disclosed herein. A contact imaging system can include a contact imager. The contact imager can include a housing having a base and a lid. The lid can have a closed position against the base and an open position. The contact imager can include a contact area image sensor. The lid can shield the contact area image sensor from ambient light when the lid is in the closed position. The contact imager can include an illuminator that can illuminate at least a portion of a blot on the contact area image sensor when the lid is in the closed position.
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公开(公告)号：US11956522B2
公开(公告)日：2024-04-09
申请号：US18063946
申请日：2022-12-09
Applicant: BIO-RAD LABORATORIES, INC.
Inventor： Stephen Swihart , Li Lu , Wade Jameson , Evan Thrush , Michael Griffin , Evelio Perez
CPC classification number: H04N23/52 , H04N23/55 , H05K7/20472
Abstract: An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.
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公开(公告)号：US20210356397A1
公开(公告)日：2021-11-18
申请号：US17314406
申请日：2021-05-07
Applicant: BIO-RAD LABORATORIES, INC.
Inventor： Stephen Swihart , Evan Thrush , Kevin McDonald
Abstract: An imaging system including an illuminator apparatus or an epi-illumination apparatus that has LEDs for illuminations is provided for stain-free gel activation and fluorescent sample visualization. The illuminator apparatus includes a housing, a light source array disposed on at least one side surface of the housing and including at least one plurality of LEDs having each LED individually operable to output light of a predetermined color within a range of wavelengths, and a controller for controlling ranges of operational parameters of the at least one plurality of LEDs. The light emitted from the light source array incidents upon a sample having a gel that includes a product of UV light induced reaction between tryptophan and a haloalkane and the light emitted from the light source array includes ultraviolet (UV) light to excite a fluorescent response of the sample.
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