MULTILAYER THIN-FILM BACK CONTACT SYSTEM FOR FLEXIBLE PHOTOVOLTAIC DEVICES ON POLYMER SUBSTRATES
    5.
    发明申请
    MULTILAYER THIN-FILM BACK CONTACT SYSTEM FOR FLEXIBLE PHOTOVOLTAIC DEVICES ON POLYMER SUBSTRATES 审中-公开
    用于聚合物基板上的柔性光电器件的多层薄膜接触系统

    公开(公告)号:US20160380123A1

    公开(公告)日:2016-12-29

    申请号:US15258169

    申请日:2016-09-07

    Abstract: A photovoltaic element includes a polymer substrate having opposing device and back sides, and having a coefficient of thermal expansion of at least 4 parts per million per degree Celsius but not exceeding 12 parts per million per degree Celsius. A metal structure is disposed on the device side of the polymer substrate, and the metal structure includes (a) a transition-metal-based layer disposed on the polymer substrate, (b) an aluminum-based barrier layer disposed on the transition-metal-based layer, and (c) a molybdenum-based cap layer disposed on the aluminum-based barrier layer. A CIGS photovoltaic structure is disposed on the molybdenum-based cap layer.

    Abstract translation: 光电元件包括​​具有相对的装置和背面的聚合物基板,并且其热膨胀系数为每摄氏度至少4百万分之一,但不超过每百万摄氏度百万分之一。 金属结构设置在聚合物基板的器件侧,金属结构体包括(a)设置在聚合物基板上的过渡金属基层,(b)设置在过渡金属上的铝基阻挡层 (c)设置在铝基阻挡层上的钼基覆盖层。 CIGS光伏结构设置在钼基覆盖层上。

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