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    Method of producing a plurality of engineered-components using an additive manufacturing process
    1.
    发明授权
    Method of producing a plurality of engineered-components using an additive manufacturing process 有权

    公开(公告)号：US10576725B2

    公开(公告)日：2020-03-03

    申请号：US15492411

    申请日：2017-04-20

    申请人： Aptiv Technologies Limited

    发明人： Robert J. Seidler ,  Gerald A. Rhinehart, Jr.

    IPC分类号： B29C64/40 ,  B33Y10/00

    摘要： A method of producing engineered-components using an additive manufacturing process includes the steps of, providing a build-platform, forming a first engineered-component, forming support-structures, forming a second engineered-component, and removing the support-structures. The step of providing a build-platform includes providing a build-platform on which to form an engineered-component. The step of forming a first engineered-component includes depositing a first plurality of layers of a material onto the build-platform and solidifying the first plurality of layers. The step of forming support-structures includes forming a plurality of support-structures by depositing a second plurality of layers of the material onto the build-platform and solidifying the second plurality of layers. The step of forming a second engineered-component includes depositing a third plurality of layers of the material onto the plurality of support-structures and solidifying the third plurality of layers. The step of removing the support-structures includes removing the support-structures from the second engineered-component.

    Apparatus and method for manufacturing assembly having multiple separated conductors embedded within a substrate
    2.
    发明授权
    Apparatus and method for manufacturing assembly having multiple separated conductors embedded within a substrate 有权

    公开(公告)号：US11749427B2

    公开(公告)日：2023-09-05

    申请号：US17319686

    申请日：2021-05-13

    申请人： Aptiv Technologies Limited

    发明人： Jared Bilas ,  David R. Peterson ,  Gerald A. Rhinehart, Jr.

    IPC分类号： H01B13/012 ,  G05B19/04 ,  G05B19/418

    CPC分类号： H01B13/01236 ,  G05B19/0405 ,  G05B19/4185 ,  H01B13/01209

    摘要： An apparatus includes an extruding device configured to dispense a dielectric material though an orifice, a wire feed device configured to feed a conductive wire through the orifice, and a cutting device configured to sever the wire. It also includes an electronic controller configured to control the extruding device, the wire feed device, and the cutting device. The electronic controller commands the extruding device to dispense the dielectric material though the orifice, the wire feed device to feed the wire through the orifice, and the cutting device to sever the wire, thereby forming a dielectric substrate encasing a plurality of wires. The electronic controller further commands the extruding device to form an opening defined in the substrate in which plurality of electrically conductive wires is exposed and a location feature on the substrate located with a positional tolerance less than or equal to 1 mm relative to the opening.

    Apparatus and method for manufacturing assembly having multiple separated conductors embedded within a substrate
    5.
    发明授权
    Apparatus and method for manufacturing assembly having multiple separated conductors embedded within a substrate 有权

    公开(公告)号：US11037706B2

    公开(公告)日：2021-06-15

    申请号：US16203695

    申请日：2018-11-29

    申请人： Aptiv Technologies Limited

    发明人： Jared Bilas ,  David R. Peterson ,  Gerald A. Rhinehart, Jr.

    IPC分类号： H01B13/012 ,  G05B19/04 ,  G05B19/418

    摘要： An apparatus includes an electronic controller having a memory device and an extruding device connected to the electronic controller. The extruding device has a dispensing head configured to dispense a dielectric material though an orifice in the dispensing head as commanded by the electronic controller. A wire feed device is connected to the electronic controller and the extruding device and is configured to feed a conductive wire through the orifice as commanded by the electronic controller. A cutting device is connected to the electronic controller and the extruding device. The cutting device severs the wire after it is fed through the orifice as commanded by the electronic controller. An electromechanical device is connected to the electronic controller and to the extruding device. The electromechanical device is configured to move the extruding device, the wire feed device, and the cutting device within a 3D space as commanded by the electronic controller.