公开(公告)号：US09327324B2

公开(公告)日：2016-05-03

申请号：US13777044

申请日：2013-02-26

Applicant: Applied Materials Israel Ltd.

Inventor： Lior Segev ,  Irit Ruach Nir ,  Guy Eitan

IPC: B08B6/00 ,  B08B7/00 ,  H01J37/02 ,  H01J37/20 ,  H01J37/32

CPC classification number: B08B7/00 ,  H01J37/02 ,  H01J37/20 ,  H01J37/32862 ,  H01J2237/006 ,  H01J2237/022

Abstract: A system and method are described, for use in cleaning of a vacuum chamber. The method comprising connecting a vacuum chamber to a plasma generating unit via a plasma connection port and connecting the vacuum chamber to a high vacuum pumping unit via a pumping port. A flow conductance through the plasma connection port to the vacuum chamber is controlled to limit passage of charged particles and cleaning substances produced in the plasma generating unit, to thereby maintain a working pressure inside the vacuum chamber while cleaning the vacuum chamber by said cleaning substances.

Abstract translation: 描述了用于清洁真空室的系统和方法。 该方法包括通过等离子体连接端口将真空室连接到等离子体产生单元，并通过泵送端口将真空室连接到高真空泵送单元。 控制通过等离子体连接端口到真空室的流动传导，以限制带电粒子和等离子体发生单元中产生的清洁物质的通过，从而在通过所述清洁物质清洁真空室的同时保持真空室内的工作压力。

公开(公告)号：US20140238438A1

公开(公告)日：2014-08-28

申请号：US13777044

申请日：2013-02-26

Applicant: APPLIED MATERIALS ISRAEL LTD.

Inventor： Lior Segev ,  Irit Ruach Nir ,  Guy Eitan

IPC: B08B7/00 ,  H01J37/20

CPC classification number: B08B7/00 ,  H01J37/02 ,  H01J37/20 ,  H01J37/32862 ,  H01J2237/006 ,  H01J2237/022

Abstract: A system and method are described, for use in cleaning of a vacuum chamber. The method comprising connecting a vacuum chamber to a plasma generating unit via a plasma connection port and connecting the vacuum chamber to a high vacuum pumping unit via a pumping port. A flow conductance through the plasma connection port to the vacuum chamber is controlled to limit passage of charged particles and cleaning substances produced in the plasma generating unit, to thereby maintain a working pressure inside the vacuum chamber while cleaning the vacuum chamber by said cleaning substances.

Abstract translation: 描述了用于清洁真空室的系统和方法。 该方法包括通过等离子体连接端口将真空室连接到等离子体产生单元，并通过泵送端口将真空室连接到高真空泵送单元。 控制通过等离子体连接端口到真空室的流动传导，以限制带电粒子和等离子体发生单元中产生的清洁物质的通过，从而在通过所述清洁物质清洁真空室的同时保持真空室内的工作压力。