公开(公告)号：US20240255700A1

公开(公告)日：2024-08-01

申请号：US18102927

申请日：2023-01-30

Applicant: Applied Materials, Inc.

Inventor： Eric Jay Simmons ,  Qintao Zhang ,  Wei Zou ,  Andrew Michael Waite ,  Jared Forrest Traynor ,  Miguel Sam Fung ,  Vincent V. Granuzzo ,  David J. Lee

IPC: G02B6/134 ,  H01L27/144

CPC classification number: G02B6/1347 ,  H01L27/1443

Abstract: Disclosed herein are approaches for forming a uniform film with reduced surface roughness for photonic applications. One method includes providing a workpiece including a contact etch stop layer (CESL) over a device layer, patterning the CESL to expose an upper surface of the device layer in a waveguide target area, and patterning a waveguide from a dielectric film formed over the waveguide target area. The method may further include directing ions into an upper surface of the waveguide using a high-temperature ion implant to decrease a surface roughness of the upper surface of the waveguide.