IN-SITU ION BEAM ANGLE MEASUREMENT

    公开(公告)号:US20250069850A1

    公开(公告)日:2025-02-27

    申请号:US18236711

    申请日:2023-08-22

    Abstract: A processing system that includes an ion source to direct an ion beam at a workpiece, and an angle measurement system, is disclosed. The angle measurement system includes a current measurement device, such as one or more Faraday sensors, that may be moved in at least two orthogonal directions. The current measurement device scans in a first direction, seeking the largest current measurement. The current measurement device then moves to a second position in the second direction and repeats the scanning procedure. Based on data collected at two different locations in the second direction, the angle of incidence of the incoming ion beam may be determined.

Patent Agency Ranking