公开(公告)号：US20240011147A1

公开(公告)日：2024-01-11

申请号：US18349006

申请日：2023-07-07

Applicant: Applied Materials, Inc.

Inventor： Andrew CEBALLOS ,  Suraj YADAV ,  Kazuya DAITO

IPC: C23C14/50

CPC classification number: C23C14/50

Abstract: Apparatus for processing a semiconductor substrate are described herein. The apparatus include an electrostatic chuck within a physical vapor deposition process chamber. The electrostatic chuck is covered by a cover plate and has an edge ring disposed around the cover plate. The cover plate includes an alignment portion as well as a central support. An outer ring may extend from the cover plate to further support a substrate. A spacer is utilized to raise the edge ring to an appropriate height for processing of an optical device in the physical vapor deposition process chamber.

公开(公告)号：US20220229370A1

公开(公告)日：2022-07-21

申请号：US17579349

申请日：2022-01-19

Applicant: Applied Materials, Inc.

Inventor： Jing JIANG ,  Suraj YADAV ,  Amita JOSHI ,  Vivian HSU

IPC: G03F7/20

Abstract: Apparatus and methods of performing nanoimprint lithography using an anti-slip landing ring are provided. In one embodiment, a process chamber for nanoimprint lithography is provided and includes a substrate support and a ring disposed on the substrate support. The ring has a top surface opposite the substrate support, and the top surface has a grid pattern. A bottom surface facing the substrate support has a different pattern compared to the grid pattern.