公开(公告)号：US20180119285A1

公开(公告)日：2018-05-03

申请号：US15787328

申请日：2017-10-18

Applicant: Applied Materials, Inc.

Inventor： Shinichi KURITA ,  Makoto INAGAWA ,  Suhas BHOSKI

IPC: C23C16/52 ,  C23C16/02

CPC classification number: C23C16/52 ,  C23C14/042 ,  C23C14/568 ,  C23C16/0209 ,  C23C16/042 ,  C23C16/54

Abstract: Embodiments described herein relate to a thermal chamber utilized in the processing of display substrates. The thermal chamber may be part of a larger processing system configured to manufacture OLED devices. The thermal chamber may be configured to heat and cool masks and/or substrates utilized in deposition processes in the processing system. The thermal chamber may include a chamber body defining a volume sized to receive one or more cassettes containing a plurality of masks and/or substrates. Heaters coupled to the chamber body within the volume may be configured to controllably heat masks and/or substrates prior to deposition processes and cool the masks and/or substrates after deposition processes.

公开(公告)号：US20180155835A1

公开(公告)日：2018-06-07

申请号：US15829667

申请日：2017-12-01

Applicant: Applied Materials, Inc.

Inventor： Shinichi KURITA ,  Srikanth V. RACHERLA ,  Suhas BHOSKI ,  Xiangxin RUI

IPC: C23C16/455 ,  C23C16/458 ,  C23C16/44 ,  C23C16/04

CPC classification number: C23C16/45544 ,  C23C16/042 ,  C23C16/4401 ,  C23C16/4412 ,  C23C16/45529 ,  C23C16/45542 ,  C23C16/458 ,  C23C16/54

Abstract: The present disclosure relates to methods and apparatus for a thin film encapsulation (TFE). In one embodiment a process kit for use in an atomic layer deposition (ALD) chamber is disclosed and includes a dielectric window, a sealing frame, and a mask frame connected with the sealing frame, wherein the mask frame has a gas inlet channel and a gas outlet channel formed therein on opposing sides thereof.