公开(公告)号：US20170263422A1

公开(公告)日：2017-09-14

申请号：US15288577

申请日：2016-10-07

Applicant: Applied Materials, Inc.

Inventor： Timothy Stuart OCHSNER ,  Robin L. TINER ,  William Norman STERLING ,  Jonathan R. WILLEY

IPC: H01J37/32 ,  B23K1/00 ,  B23K1/19 ,  H05B3/02 ,  B23K35/28 ,  B23K35/362 ,  H05B3/00 ,  C25D11/16 ,  B23K1/20

CPC classification number: H01J37/32724 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/19 ,  B23K1/203 ,  B23K35/286 ,  B23K35/362 ,  B23K2101/36 ,  B23K2103/10 ,  B23K2103/18 ,  C23C16/4586 ,  C25D11/16 ,  H05B3/48

Abstract: A substrate support and method of forming a substrate support are described herein. In one example, a substrate support includes an aluminum body having an upper surface configured to support a large area substrate, a heater element, and a filler material. The aluminum body has a groove formed therein. The heater element is disposed in the groove. The filler material is in contact with the heater element and fills the groove. The contact between the filler material and the perimeter of the heater element is the only material interface within the groove, and the filler material has a larger grain size than a grain size of the aluminum body.