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    ORBITAL POLISHING WITH SMALL PAD
    2.
    发明申请
    ORBITAL POLISHING WITH SMALL PAD 审中-公开
    ORBITAL POLISHING WITH SMAD PAD

    公开(公告)号：US20160016280A1

    公开(公告)日：2016-01-21

    申请号：US14334608

    申请日：2014-07-17

    Applicant: Applied Materials, Inc.

    Inventor： Hung Chih Chen ,  Paul D. Butterfield ,  Jay Gurusamy ,  Jason Garcheung Fung ,  Shou-Sung Chang ,  Jimin Zhang ,  Eric Lau

    IPC: B24B37/10 ,  H01L21/768 ,  H01L21/67

    CPC classification number: B24B37/10

    Abstract: A chemical mechanical polishing apparatus includes a plate on which a substrate is received, and a movable polishing pad support and coupled polishing pad which move across the substrate and orbit a local region of the substrate during polishing operation. The load of the pad against the substrate, the revolution rate of the pad, and the size, shape, and composition of the pad, may be varied to control the rate of material removed by the pad.

    Abstract translation: 化学机械抛光装置包括其上容纳有基底的板，以及可抛光垫支撑和耦合的抛光垫，其在抛光操作期间移动穿过基板并且在基板的局部区域上轨道。 可以改变衬垫抵靠衬底的载荷，垫的转速以及衬垫的尺寸，形状和组成，以控制衬垫移除的材料的速率。

    Multi-disk chemical mechanical polishing pad conditioners and methods
    5.
    发明授权
    Multi-disk chemical mechanical polishing pad conditioners and methods 有权
    多盘化学机械抛光垫调节剂及方法

    公开(公告)号：US09308623B2

    公开(公告)日：2016-04-12

    申请号：US14256704

    申请日：2014-04-18

    Applicant: Applied Materials, Inc.

    Inventor： Hung Chen ,  Shou-Sung Chang ,  Jason Garcheung Fung ,  Matthew A. Gallelli ,  Paul D. Butterfield ,  Kevin Chou

    IPC: B24B53/017

    CPC classification number: B24B53/017

    Abstract: A pad conditioner may include multiple independently mounted conditioning elements configured to condition a polishing pad used in, e.g., a chemical mechanical polishing (CMP) process. In some embodiments, the pad conditioner may include a main assembly disk and a main assembly base plate attached to the main assembly disk via a gimbal connection. A plurality of pad conditioner assemblies may be attached to the main assembly base plate. In some embodiments, each pad conditioner assembly may include a pad conditioner disk attached to the main assembly base plate, a pad conditioner base attached to the pad conditioner disk via a gimbal connection, and a conditioning element attached to the pad conditioner base. Methods of conditioning a polishing pad are also provided, as are other aspects.

    Abstract translation: 衬垫调节器可以包括多个独立安装的调节元件，其被配置为调节在例如化学机械抛光（CMP）工艺中使用的抛光垫。 在一些实施例中，垫调节器可以包括主组件盘和通过万向接头连接到主组件盘的主组件底板。 多个垫调节器组件可以附接到主组件基板。 在一些实施例中，每个垫调节器组件可以包括附接到主组件基板的垫调节器盘，通过万向接头连接到垫调节盘的垫调节器基座和附接到垫调节器基座的调节元件。 还提供了调整抛光垫的方法，以及其它方面。

    MULTI-DISK CHEMICAL MECHANICAL POLISHING PAD CONDITIONERS AND METHODS
    6.
    发明申请
    MULTI-DISK CHEMICAL MECHANICAL POLISHING PAD CONDITIONERS AND METHODS 有权
    多盘化学机械抛光垫片调节器及方法

    公开(公告)号：US20140315473A1

    公开(公告)日：2014-10-23

    申请号：US14256704

    申请日：2014-04-18

    Applicant: Applied Materials, Inc.

    Inventor： Hung Chen ,  Shou-Sung Chang ,  Jason Garcheung Fung ,  Matthew A. Gallelli ,  Paul D. Butterfield ,  Kevin Chou

    IPC: B24B53/017

    CPC classification number: B24B53/017

    Abstract: A pad conditioner may include multiple independently mounted conditioning elements configured to condition a polishing pad used in, e.g., a chemical mechanical polishing (CMP) process. In some embodiments, the pad conditioner may include a main assembly disk and a main assembly base plate attached to the main assembly disk via a gimbal connection. A plurality of pad conditioner assemblies may be attached to the main assembly base plate. In some embodiments, each pad conditioner assembly may include a pad conditioner disk attached to the main assembly base plate, a pad conditioner base attached to the pad conditioner disk via a gimbal connection, and a conditioning element attached to the pad conditioner base. Methods of conditioning a polishing pad are also provided, as are other aspects.

    Abstract translation: 衬垫调节器可以包括多个独立安装的调节元件，其被配置为调节在例如化学机械抛光（CMP）工艺中使用的抛光垫。 在一些实施例中，垫调节器可以包括主组件盘和通过万向接头连接到主组件盘的主组件底板。 多个垫调节器组件可以附接到主组件基板。 在一些实施例中，每个垫调节器组件可以包括附接到主组件基板的垫调节器盘，通过万向接头连接到垫调节盘的垫调节器基座和附接到垫调节器基座的调节元件。 还提供了调整抛光垫的方法，以及其它方面。

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